Dr. Y. C. Lee is the President and CEO of Kelvin Thermal founded in June 2014. Kelvin Thermal owns exclusive licenses of intellectual properties of flexible thermal ground plane (TGP) established by the University of Colorado Boulder through a DARPA TGP project. Dr. Lee is also the S. J. Archuleta Professor at the Department of Mechanical Engineering, University of Colorado Boulder (CU-Boulder).  From 2006 to 2012, he served as the Director of the DARPA Center for Integrated Micro/Nano-Electromechanical Transducers (iMINT) hosted by CU-Boulder.  From 1993 to 2002, he served as an Associate Director of the National Science Foundation (NSF) Center for Advanced Manufacturing and Packaging of Microwave, Optical and Digital Electronics (CAMPmode), CU-Boulder. Prior to joining the University in 1989, he was a Member of Technical Staff at AT&T Bell Laboratories, Murray Hill, New Jersey.  Dr. Lee is recognized for his research contributions in packaging and interconnect for microsystems integrating microelectronic, optoelectronic, microwave, and microelectromechanical and nanoelectromechanical devices.   He is the Editor of ASME Journal of Electronic Packaging. He has received the following awards/honors: 1) ASME InterPACK Achievement Award, 2013; 2) ASME Electronic and Photonic Packaging Division’s Mechanics Award, 2007; 3) ASME Fellow, 2002;  4) Presidential Young Investigator Award, NSF, 1990; and 5) Outstanding Young Manufacturing Engineer Award, SME, 1992.