Victor Zaderej
Victor Zaderej is the Manager of Advanced Development for Molex�s Solid State Lighting Group where he provides strategic direction for the group as well as is responsible for the next generation of solid state lighting products.
Victor joined Molex in 2000 when Molex purchased his and a business partner�s company, Three Dimensional Interconnects Incorporated (3Di). The antenna business unit which was started as a result of the 3Di purchase now generates over $110,000,000 in revenue for Molex.
Victor began his work in the area of applying circuitry to three dimensional plastic components in 1987 while working for IBM�s personal computer division where he was the lead engineer for the IBM PS/2 Model 50. He left IBM in 1989 for a joint venture between GE Plastics and Circuit Wise, specializing in the design and manufacture of MIDs (Molded Interconnect Devices). Working with both domestic and international customers to develop new applications as well as perfecting the technology to manufacture MIDs, Victor has been exposed to all aspects of using the technology to provide solutions to challenging electromechanical packaging applications.
Victor received his B.S. and M.S. in Mechanical Engineering from MIT in Mechanical Engineering. He completed his MBA in 1995 from Quinnipiac University. He holds 33 patents within the fields of electrical packaging, thermal management, energy conservation, and solid state lighting.
He lives in St. Charles, Illinois. His interests include tennis, scuba, chess, and training architects, homeowners, and builders on the design of super energy efficient homes.
Victor joined Molex in 2000 when Molex purchased his and a business partner�s company, Three Dimensional Interconnects Incorporated (3Di). The antenna business unit which was started as a result of the 3Di purchase now generates over $110,000,000 in revenue for Molex.
Victor began his work in the area of applying circuitry to three dimensional plastic components in 1987 while working for IBM�s personal computer division where he was the lead engineer for the IBM PS/2 Model 50. He left IBM in 1989 for a joint venture between GE Plastics and Circuit Wise, specializing in the design and manufacture of MIDs (Molded Interconnect Devices). Working with both domestic and international customers to develop new applications as well as perfecting the technology to manufacture MIDs, Victor has been exposed to all aspects of using the technology to provide solutions to challenging electromechanical packaging applications.
Victor received his B.S. and M.S. in Mechanical Engineering from MIT in Mechanical Engineering. He completed his MBA in 1995 from Quinnipiac University. He holds 33 patents within the fields of electrical packaging, thermal management, energy conservation, and solid state lighting.
He lives in St. Charles, Illinois. His interests include tennis, scuba, chess, and training architects, homeowners, and builders on the design of super energy efficient homes.