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coolingzone newsletter for april 11, 2013 april 11, 2013
top stories
major improvements in tim conductivity with graphene fillers
with power dissipation rising, there is a need for tims with higher levels of thermal conductivity; graphene may be the answer.
using liquid metal as the coolant
liquid metal may seem extreme, but when specs demand it, liquid metal can be a viable option
understanding system performance at altitude while on the ground
engineers often need to understand a system's performance at various altitudes, here's how
how to creat a quick multitemperature lithium cell simulation model
lithium battery modeling can be done in cfd, but is there a quicker method just as useful?
product news
nxp introduces very tiny real-time clock operating at very low voltage
nxp semiconductors n.v. today introduced the pcf85063, a new family of very tiny real-time clocks operating at very low voltages down to 0.9 v. with...
applied nanotech to exhibit at printed electronics europe 2013
applied nanotech will present its revolutionary new printed circuit board (pcb) concept that integrates printed electronics with its high thermal...
gelid solutions launches slimhero cpu cooler for amd and intel cpu's
the "slimhero" features 4 sintered power heatpipes with a silent and slim 120mm fan. the copper heatpipes ensure maximum heat transfer from...
act heat pipes reach 1 million hours on-orbit milestone
act's constant conductance heat pipes (cchps) have successfully reached over 1 million total hours on-orbit, providing thermal management on-board...
grafoid inc. and captherm systems inc. joint venture to develop next-generation graphene cooling systems for ev and led applications
grafoid, a firm focused on high-energy graphene and the development of graphene industrial applications will supply materials and science for...
thermacore division k technology highlights encapsulated graphite for thermal management
advanced solid conduction concepts from k technology are used in thermal applications all over the world. among its primary thermal solutions, k...
mitsubishi plastics successfully reduces costs to produce ultra-high-modulus grade pitch-based carbon fiber with excellent thermal conductivity
mitsubishi plastics, inc. apprised that it has succeeded in nearly halving the production costs of its ultra-high-modulus grade of pitch-based carbon...
gene kranz highlight of star global conference 2013
gene kranz, legendary nasa flight director, was the keynote speaker at star global conference 2013. his riveting presentation detailed his experience...
technology corner
turn up the juice: new flywheel raises hopes for energy storage breakthrough [scientific american]
storing electricity in spinning wheels isn't new, but a new design may make it cheap enough to compete with other technologies
ibm researchers to design liquid cooling directly into microchip designs and packaging [military and aerospace]
ibm is taking the first steps in a u.s. military research program in electronics thermal management that seeks to design convective or evaporative...
watching fluid flow at nanometer scales [ecn weekly]
new research carried out at mit and elsewhere has demonstrated for the first time that nanowires naturally draw liquid upward in a thin film that...
another reason not to like pin fin heat sinks? [linked in engienering debate]
maybe i shouldn't let my analysis tools dictate my thermal designs, but it is really tricky to predict the performance of pin fin heat sinks from...
sun catalytix seeks second act with flow battery [mit technology review]
the mit spin-off had hoped to enable the hydrogen economy in developing countries, but is now at work on a flow battery using “designer...
engineering how to
vapor chambers and their use in thermal management (part 1 of 2)
vapor chambers, what they are, how they work, and their use in thermal management. in part 1 we’ll cover what a vapor chamber is and their...
vapor chambers and their use in thermal management (part 2 of 2)
vapor chambers, more about why vapor chambers are effective, as well as their application in thermal management of electronics.
heat sink materials: choices and tradeoffs
a review of traditional and a consideration of advanced materials used in thermal management and electronics cooling. advanced thermal interface...

conferences & webinars
world conferences on experimental heat transfer, fluid mechanics and thermodynamics (portugal, lisbon | 6-16-2013)
the goal of this conference is to provide a forum for the exposure and exchange of ideas, methods and results in heat transfer, fluid mechanics and thermodynamics.
asme 2013 summer heat transfer conference (usa, mn | 7-14-2013)
july 14 - july 19 2013 minneapolis minnesota asme 2013 summer heat transfer conference, 7th international conference on energy sustainability, and 11th fuel cell science, engineering and technology conference (htesfuelcell2013)
advancements in thermal management (usa, co | 6-6-2013)
the conference is designed for design engineers, system engineers, process engineers, material scientists and engineers, ctos and r&d managers with organizations in industries and markets whose products, operations and services depend upon sophisticated and precise control of thermal properties and states.
nasa thermal fluids and analysis workshop (usa, fl | 7-29-2013)
tfaws is an annual training and professional development workshop designed to encourage knowledge sharing, professional development, and networking throughout the thermal and fluids engineering community within nasa and the aerospace community at large.
coolingzone 13, international business and technology summit (usa, ma | 10-21-2013)
coolingzone summit gathers together world re-known experts in thermal management to share their latest developments and research, and discuss emerging technologies for advanced cooling of electronic systems.

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