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coolingzone newsletter may 24, 2013 may 24, 2013
top stories
optimization of microchannel heat exchangers
as power densities steadily rise, microchannel heat sinks may be a good bet to cool them
how to liquid cool an itx form factor pc
latest pc build guide shows how even a small pc can be overclocked and water cooled
how to choose the best heat sink attachment method
get your heat sink attachment right by choosing the best option for your application
cfd, data center cooling, heat pipes and more at coolingzone-13
coolingzone-13 features presentations from leading thermal management solutions providers
product news
touchstone semiconductor introduces the industry's only ultra low-power, load independent, high-efficiency boost
touchstone semiconductor, a leading developer of high-performance, low-power analog integrated circuit solutions, today announced the ts3300 boost...
unique nanoceramic-aluminum substrate for thermal management of electronics gains ground in industry [video]
cambridge nanotherm has developed and patented a unique nanoceramic-aluminum substrate for thermal management of electronics which offers the...
evga introduced brand new cooling design; the redefining evga acx cooler [video]
evga's new cooling design give a 40% increase in heatsink volume, the evga acx is more efficient at dissipating heat, allowing for 15% lower gpu...
coolermaster releases compact mainstream pc chassis with extensive water cooling support
coolermaster's n200 chassis is water cooling ready and improved air cooling performance wrapped in subtle and simplistic designs
ceramtec highlights ceramcool heat-sinks
ceramtec ceramic heat sinks are made from alumina and aluminum nitride and are targeted for high power electronics and led applications
avoid inaccuracies in thermal simulation with cd-adapco june 6th webinar [sponsored]
historically, thermal simulations of electronic systems have utilized dramatically simplified geometric versions of the systems. for many modern...
new dow corning dispensable thermal pads offer increased thermal performance, lower system costs for led lamps and luminaires
dow corning dispensable thermal pads are a new material that now enables led lamp and luminaire manufacturers to quickly and precisely print a layer...
new patented heat sink mounting system is industry first with secure click and latch
the new pem(tm) heat sink mounting system (patent pending) introduces an ideally engineered solution to securely attach heat sinks to circuit boards...
advancements in thermal management 2013 conference - june 6-7, denver. colorado [sponsored]
the advancements in thermal management 2013 conference will be held june 6-7, 2013 in denver, colo. highlighting the latest advancements in...
thermacore division k technology highlights encapsulated graphite for thermal management
advanced solid conduction concepts from k technology are used in thermal applications all over the world. among its primary thermal solutions, k...
technology corner
engineering mistakes become innovations: when chocolate meets physics and the invention of the microwave oven [coolingzone blog]
an estimated 94% of all u.s. households own a microwave oven. whether black laminate or gleaming chrome, “nuke it!” has turned from cold war...
thermal electric coolers offer advantages for thermal testing [test and measurement world]
testing semiconductors across a wide range of temperatures during manufacturing test, with the device under test (dut) operating, was originally...
avoid these five common mistakes during power supply integration [electronic design]
commercial ac-dc supplies from a reputable manufacturer often are taken for granted when used as basic drop-in, no-headache components. making some...
how to improve heat dissipation in 3-d microelectronic systems [design world online]
researchers from the georgia institute of technology have an idea on how to address this issue and have won a defense advanced research projects...
cambridge nanotherm's tecnology makes the flat surface of an aluminium heatsink into a pcb [electronics weekly]
cutting the temperature of lighting leds makes them more efficient, and more efficient leds mean fewer leds for a given amount of light, which makes...
engineering how to
how to use fan trays to cool electronics systems
despite rampant increases in power dissipation, the use of liquid for cooling electronics remains sporadic. air cooling continues to be the dominant...
how to properly select a heat sink
long life and reliable performance of a component may be achieved by effectively controlling the device operating temperature within the limits set...
how to do natural convection modeling of heat sinks
heat transfer in electronic packages is a complex problem involving a network of resistive paths for the various laminated structures, bonding...

conferences & webinars
coolingzone-13: the thermal management industry international summit (usa, ma | 10-21-2013)
join the thermal management industries leading companies to not just hear theory but solutions, from the industry's leading suppliers. you won’t leave with formulas, you’ll leave with answers from these leading suppliers and technologists in thermal management.
advancements in thermal management (usa, co | 6-6-2013)
the conference is designed for design engineers, system engineers, process engineers, material scientists and engineers, ctos and r&d managers with organizations in industries and markets whose products, operations and services depend upon sophisticated and precise control of thermal properties and states.
world conferences on experimental heat transfer, fluid mechanics and thermodynamics (portugal, lisbon | 6-16-2013)
the goal of this conference is to provide a forum for the exposure and exchange of ideas, methods and results in heat transfer, fluid mechanics and thermodynamics.
asme 2013 summer heat transfer conference (usa, mn | 7-14-2013)
asme 2013 summer heat transfer conference, 7th international conference on energy sustainability, and 11th fuel cell science, engineering and technology conference (htesfuelcell2013)
nasa thermal fluids and analysis workshop (usa, fl | 7-29-2013)
tfaws is an annual training and professional development workshop designed to encourage knowledge sharing, professional development, and networking throughout the thermal and fluids engineering community within nasa and the aerospace community at large.

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