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coolingzone newletter for july 1, 2013 july 01, 2013
top stories
jim burnett of aspen systems to speak at coolingzone-13
latest advances in miniaturized vapor compression electronics cooling at coolingzone-13
ultra thin flat heat pipes for thermal management of electronics
even smart phones will have heat pipes, but how do you make them thin and flat enough?
coolingzone-13 registration open
register today for coolingzone-13 thermal managment summit, october 21-23rd, boston ma
design of liquid cooled heat sinks and cold plates
fundamental concepts for transitioning from air to liquid cooling (free pre-recorded lecture)
product news
coolingzone-13 thermal management summit answers two critical questions
this year conference organizers have asked the speakers to address two specific questions to prepare mechanical thermal engineers for the future....
rittal highlights lcp dx cooling, the system solution for smaller data centers
the rittal liquid cooling package direct (lcp dx) is a flexible climate control option for use in small and medium enterprises. it can dissipate...
leading thermal solutions and flexible circuit manufacturer strengthens representative network in the united states
vulcan electric company today announced that it has expanded its presence in the united states by establishing a representative relationship with...
cd-adapco releases star-ccm+ v8.04 for cfd
star-ccm+ v8.04 for cfd features these enhancements: dramatic improvements in the parallel scalability for complex multi-region simulations, multiple...
fabrico delivers advanced thermal management for leds in automotive applications
fabrico now offers flexible materials, advanced assembly and thermal management capabilities for led use in automotive/transportation applications.
cambridge nanotherm delivers the first commercial order for its ground-breaking chip-on-heatsink technology in partnership with optocap
cambridge nanotherm has announced, in partnership with optocap, an advanced microelectronic and optoelectronic packaging design and assembly company,...
vette corp expands rear door heat exchanger offering for data center liquid cooling
vette corp announces an expanded liquid cooling product line for high density server, storage and communications equipment. vette’s family of...
t-global technology are pleased to announce their new range of thermally conductive interface caps.
the thinc range of interface caps offer exceptionally low thermal contact resistance and electrical isolation which ensures maximum protection...
colder products connector family designed for liquid cooling of electronics
safeguard electronics and reduce downtime associated with installation, service and maintenance. quick disconnect couplings make maintaining liquid...
technology corner
do you characterize your heat sinks in a wind tunnel? [coolingzone 30-second poll]
our latest 30-second poll asks about how you characterize your heat sinks: in a wind tunnel or not? anecdotal evidence suggests engineers have...
graphene-based ink promises future flexible electronics [ieee spectrum]
researchers at northwestern university’s mccormick school of engineering have developed a graphene-based ink that could be sprayed onto substrates...
chip-on-heatsink game-changer [electronics weekly]
cambridge nanotherm, the two year-old nano-ceramic specialist, has shipped its first products – a chip-on-heatsink module. the customer is an led...
thermal transient testing reveals long-term tim performance [design news]
solid state lighting, especially high-power, high-brightness leds, are increasingly competing with traditional light sources. their energy efficiency...
exotic alloys for potential energy applications [nano-werk]
“the rigid band approach still supplies the simple, predictive engineering concepts we need for discovering fruitful thermoelectric material...
engineering how to
how to more fully compare heat sinks on cost and performance
simplistic comparison of heat sinks does not take into account the flow performance, effect on neighboring and downstream components,weight, volume...
what is the air efficiency concept and how to apply it
this article is about the air efficiency. it is a property that quantifies how well the airflow is used for cooling. there is nothing innovative...
what is jet impingement cooling and how is it applied for thermal management of electronics (part 1 of 2) [sponsored]
continued power increases in devices, such as processors and igbts are requiring high capacity cooling methods to remove excess heat. one such...

conferences & webinars
coolingzone-13: the thermal management industry international summit (usa, ma | 10-21-2013)
join the thermal management industries leading companies to not just hear theory but solutions, from the industry's leading suppliers. you won’t leave with formulas, you’ll leave with answers from these leading suppliers and technologists in thermal management.
asme 2013 summer heat transfer conference (usa, mn | 7-14-2013)
asme 2013 summer heat transfer conference, 7th international conference on energy sustainability, and 11th fuel cell science, engineering and technology conference (htesfuelcell2013)
nasa thermal fluids and analysis workshop (usa, fl | 7-29-2013)
tfaws is an annual training and professional development workshop designed to encourage knowledge sharing, professional development, and networking throughout the thermal and fluids engineering community within nasa and the aerospace community at large.
the international heat transfer conference (ihtc), (japan | 8-10-2013)
the international heat transfer conference (ihtc), which carries a nickname of "heat transfer olympic," has traditionally been a world premier conference, where scientists and engineers in the heat and mass transfer research community get together and exchange latest information every four years. the previous conferences...

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