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coolingzone technical newsletter september 20, 2013 september 20, 2013
top stories
car makers take different routes for ev battery cooling
our technology roundup of auto makers cooling strategies for ev and hev autos
sapa extrusions aha moment for their new heat sinks
how sapa extrusions' application of friction stir welding dropped thermal resistance
overclocking extreme with liquid nitrogen
liquid nitrogen cooling tutorial shows you how to bring your cpu to -144 c
pin fin heat sink performance under air jet impingement
air jet impingement increases pin fin heat sink cooling here's how to best design the pins
coolingzone summit
coolingzone 2013 is just 4 weeks away! tech newsletter readers get 15% off till september 21st
coolingzone 2013 is just four weeks away. the summit features leading experts in thermal management and electronics cooling. topics covered include...
coolingzone 2013 adds 3 short courses to the october 21-23 summit
coolingzone 2013, being held october 21-23, 2013 in boston ma has expanded its program offering to offer three short courses for in depth thermal...
product news
wavelength electronics' new 5 a, 5 v thermoelectric controller combines high efficiency pulse-width modulated (pwm) control with excellent temperature stability
the wtcp5v5a temperature controller delivers all the advantages of pulse width modulated (pwm) control in a compact pcb mounted package. the wtcp is...
double blades, double cooler performance announced by powercolor
the patented cooler solution, double blades, brings powerful performance better than ever to high end pc gaming graphics cards and other...
imaginit technologies cfd consulting group expands as businesses realize benefits of simulation and analysis consulting
rand worldwide, a global leader in providing technology solutions to organizations with engineering design and information technology requirements,...
onset announces multichannel thermocouple data logger
onset, a world leader in data loggers, today announced the hobo ux120 thermocouple logger, a four-channel lcd data logger for measuring and recording...
mentor graphics tools included in tsmc's 3d-ic reference flow for true 3d stacking integration
mentor graphics corp. announced that its solutions have been validated by tsmc with a true 3d stacking test vehicle for tsmc's 3d-ic reference flow....
orion fans expands line of all-metal ac fans designed for harsh environment applications
orion fans, a leading manufacturer of standard and custom ac and dcfans, fan trays and accessories, has expanded its offering of ip55-rated and...
emerson network power announces cost-competitive ac-dc power supply offering full 1500 watt output across input range
emerson network power today announced a new 1500 watt ac-dc power supply that - unlike many other units in the market - does not require any derating...
fujipoly announces new low resistance tim delivers 6.0 w/m k performance
fujipoly announces the introduction of sarcon® gr45a-00 a very low modulus thermal interface material with a low thermal resistance. this new...
koolance has released three new multi-purpose cold plates
koolance has released three new multi-purpose cold plates for heat sources ranging from 25-50 mm/sq. all models use high efficiency copper microfins...
ats introduces new thermal test instrument, fsc-200, fan speed controller
ats has just introduced a new lab instrument, the fsc-200(tm) fan speed controller. this device is designed to control the fan/fan tray speed in a...
technology corner
cubic boron arsenide as a novel material for cooling of electronic devices [nano werk]
a team of theoretical physicists at the u.s. naval research laboratory (nrl) and boston college has identified cubic boron arsenide as a material...
pcb layout tips for thermal vias [edn]
know there is a lot of caution you need to exercise when trying to get the heat out of a part just using a circuit board. you have to realize the...
new sensor could prolong the lifespan of high-temperature engines []
a temperature sensor developed by researchers at the university of cambridge could improve the efficiency, control and safety of high-temperature...
improving heat removal properties of graphene [ecn]
the national science foundation awards grant to further study the thermal properties of graphene, which is expected to lead to new approaches for the...
the energy costs of cooling electronic systems: reflections on past lessons and future opportunities [villanova lab for advanced thermal and fluid systems]
should the energy costs of the cooling solutions mechanical engineers develop be a consideration in their overall design?
engineering how to
how to remove components from a pcb
in this video, a quick and relatively easy method for desoldering components is demonstrated using desoldernig braid.
how to do device thermal characterization with the electrical test method
the increased power dissipation of today's integrated circuits has made knowledge of thermal resistance important to those who manufacture and use...
how to use integrated thermal network models to to predict integrated system performance on the basis of the individual component characterization
the purpose of this article is to remind the readership of the utility of thermal network models to help understand component to component thermal...

conferences & webinars
coolingzone-13: the thermal management industry international summit (usa, ma | 10-21-2013)
join the thermal management industries leading companies to not just hear theory but solutions, from the industry's leading suppliers. you won’t leave with formulas, you’ll leave with answers from these leading suppliers and technologists in thermal management.

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