|
|
product news
|  | | future facilities has launched a significant update to its powerful, predictive modelling suite, 6sigmadc.
future facilities, the world's only provider of predictive dcim (data centre infrastructure management) software, has launched a significant update...
| |  | | fluke 2638a hydra series iii data acquisition system provides best-in-class thermocouple accuracy in a portable system
fluke corporation introduces the fluke 2638a hydra series iii, the latest addition to the hydra line of data acquisition systems / digital...
| |  | | stamped cpu heat sink improves air convection by up to 5%
assmann wsw has introduced the 'stamped cpu heat sinks' series, a combination of 'cross-cut' and 'finger-shaped heat sinks'. the series is available...
| |  | | henkel's novel thermal absorbent films deliver robust heat management for handheld devices
to address the heat management challenges associated with higher functioning, smaller footprint handheld devices, the electronics group of henkel...
| |  | | form-in-place thermal compound sets new industry benchmark
fujipoly's new sarcon spg-50a sets a new performance standard for form-in-place gap filler materials by delivering a thermal conductivity of 5.0 w/m...
| |  | | new precision temperature controllers for gas production
cracking is not typically a welcome term in most industries as there may be obvious implications of damage. that's not true for the custom energy...
| |  | | space saving, energy saving thermoelectric air conditioners
teca corporation (chicago, il) introduces the largest flush-mounted thermoelectric air conditioners currently available on the market. for enclosures...
| |  | | forecast report released on energy harvesting/regeneration for electric vehicles land, water & air 2014 - 2024
the electric vehicle industry - land, water and air - is rapidly rising to become a huge market of over $290 billion by 2024. some run entirely on...
| |  | | thermal analysis calculator estimates accurate package bottom temp based on pcb construction
the thermal analysis tool tackles the problem of estimating the rise in temperature between the ambient surrounding and the bottom of a packaged mmic...
| |  | | ats introduces new thermal test instrument, fsc-200, fan speed controller
ats has just introduced a new lab instrument, the fsc-200(tm) fan speed controller. this device is designed to control the fan/fan tray speed in a...
| |
|
|
|
conferences & webinars
|
|
ats webinar: basics and options in thermal modeling of electronic systems
november 14, 2013 at 2:00pm est, webinar. there are three fundamentals behind thermal modeling: the integral method or first order solution; computational or second order solution; the experimental or final solution. there are distinctive and unique advantages for each one. the integral model leaves us with results that... |
|
|
ichta 2014 : international conference on heat transfer and applications
january 20-21, 2014, london, uk the 2014 international conference on heat transfer and applications aims to bring together leading academic scientists, researchers and scholars to exchange and share their experiences and research results about all aspects of heat transfer and applications, and discuss the practical... |
|
|
|
|
|
|
