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coolingzone technical newsletter february 15, 2016
top stories
coolingzone 2015 pre-recorded summit
see the pre-recorded lectures from coolingzone 2015
thermal modeling for small form factor pluggable devices
communications devices are being stuffed into small, almost tiny packages like xfp, sfp's, here's how to model them
ultra thin flat heat pipes for thermal management of electronics
even smart phones will have heat pipes, but how do you make them thin and flat enough?
dimensionless numbers in heat transfer
understanding the meaning of reynolds, nusselt, rayleigh, and other dimensionless numbers
coolingzone update
coolingzone supplier directory features solutions providers in heat sinks, advanced materials and more!
coolingzone, llc and google have partnered to bring google scholar’s article library to coolingzone’s members. google scholar content is a..
coolingzone technical newsletter is chock full of engineering information
did a colleague forward this newsletter to you? why not sign up for your own? delivered to your inbox, our technical newsletter is rich with...
coolingzone partners with google scholar for in depth thermal management research
coolingzone, llc and google have partnered to bring google scholar’s article library to coolingzone’s members. google scholar content is a...
product & industry news
glacialtech announces igloo fs125s 30w cold forged pin fin heatsink and knock down kit
glacialtech, the diversified led technology provider, announces a new square heatsink using cold forging technology rated for 30w led thermal...
mentor graphics releases floefd: a cfd product
the latest version of the floefd product offers new capabilities for minimizing user time and effort spent on meshing. the floefd tool can...
sanyo denki launches highest static pressure 60 x 60 x 38 mm high static pressure fan
sanyo denki has developed and released the 60 x 60 x 38 mm high static pressure fan "san ace 60" 9hv type. this cooling fan features the...
thermoauro start-up receives investment from angels
the eastern new york angels are making a second $250,000 investment in colonie, new york, thermoelectrics company thermoaura. the latest investment...
nujay technologies - a growing demand for pcb cavities
nujay technologies, is eager to take on different types of pcb technology. we are starting to see a greater demand for pcb cavities. the main driver...
emerson adds thermal management to dcim platform
emerson network power has added visualization, scalability and thermal management capabilities to its dcim platform, trellis.
ansys unveils release 17.0
next generation of leading engineering simulation solutions offers 10x improvements in productivity, insight and performance.
aavid thermalloy llc has acquired niagara thermal products
aavid thermalloy llc has acquired niagara thermal products llc of niagara falls, ny, which has developed an extensive portfolio of thermal management...
siemens to acquire simulation software supplier cd-adapco
siemens and cd-adapco have entered into a stock purchase agreement for the acquisition of cd-adapco by siemens. the purchase price is $970 million....
altair adds cfd capabilities to hyperworks
the new capabilities add nanofluidx and ultrafluidx to the hyperworks portfolio, expanding capabilities for computational fluid dynamics (cfd). ...
technology corner
is black phosphorous the next big thing in materials? [berkeley lab]
a new experimental revelation about black phosphorus nanoribbons should facilitate the future application of this highly promising material to...
researchers render electronic components thermally invisible, thanks to thermoelectric modules []
the system, designed by by scientists at the nanyang technological university (ntu) in singapore, has the potential to fine-tune temperature...
nanoscale thermal interface eliminiate overheating in future photonic circuits [ieee spectrum]
for years the prospects of photonic circuits—those that use photons instead of the electrons—were mired in a lack-of-space problem: a photonic...
an end to scaling: intel’s next-generation chips will sacrifice speed to improve thermals [extreme tech]
intel makes historic change to chips to develop to save power and and optimize thermal management vs. speed
equinix turns to fan walls for data center cooling [equinix data center blog]
raised floor v. slab floor v. … fan wall? an old debate, a new twist
engineering how to
how to choose a heat sink from an engineering perspective [sponsored]
learn an engineering methodology and approach to choosing a heat sink for your next thermal management project. 1 hour no cost webinar.
how to apply the first law of thermodynamics
learning how to apply this simple law to heat transfer problems
how to use 3 different methods in telecommunications pcb
comparing and contrasting 3 approaches to thermal analysis of high power telecommunications boards.

conferences & webinars

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