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product & industry news
|  | | microfabrica presents new finjet thermal management design at semi-therm 33
microfabrica, the world leader in advanced additive manufacturing, presented performance results from their novel finjet thermal management device at...
| |  | | ats fansink with maxigrip adds air flow at the device level
ats offers a large family of fansink products for applications where fpga or asics in bga packages are deployed.
| |  | | elenion technologies demonstrates silicon photonic on-board optics
elenion technologies, an innovator in silicon photonic technologies, announced it will demonstrate optical-interconnect-devices (oids) for...
| |  | | mentor graphics receives harvey rosten award for thermal heatsink optimization methodology
mentor graphics corporation announced that dr. robin bornoff, dr. john parry and john wilson, a team from mentor graphics mechanical analysis...
| |  | | bel power solutions announces next generation regulated bus converter
bel power solutions, a bel group company and premier global manufacturer of power management devices, announces the 0rqb-x0s10bg.
| |  | | phononic brings high-performance electronics cooling to asia pacific
phononic, the company revolutionizing cooling and heating with solid-state technology, announced it is has expanded its global footprint within the...
| |  | | fujipoly offering new form-in-place tim to fill large gaps
fujipoly sarcon spg-30b is a highly conformable/thermally conductive, high viscosity type silicone compound.
| |  | | mahle moves into vehicle electronics with purchase of nagares
mahle plans to take over spanish electronics specialist nagares sa.
| |  | | ultra-low dropout 150ma regulator from diodes inc. supports wide input voltage range
diodes incorporated, a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete,...
| |  | | psma announces apec 2017 industry session on 3d power packaging
the power sources manufacturers association (psma) packaging committee is sponsoring an industry session at apec 2017 titled, "component,...
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conferences & webinars
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joint european thermodynamics conference
may 21-25, 2017 in budapest, hungary - methods and concepts of equilibrium and non-equilibrium thermodynamics appear in various areas of physics, engineering, sciences and humanities. this wide range of applicability is a source of inspiration, but also a cause of separation and divergence. the aim of this conference is to... |
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thermal and thermomechanical phenomena in electronic systems
may 30-june 2, 2017 in orlando, florida - sponsored by the ieee's cpmt society, itherm 2017 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. itherm 2016 will be held along with the... |
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symposium on numerical analysis of fluid flows, heat and mass transfer
25-30 september 2017, the met hotel, thessaloniki, greece - understanding fluid dynamics and heat transfer has been one of the major advances of mathematics, physics and engineering. our symposium covers various subjects: from new numerical methods and fundamental research until engineering applications. this annual... |
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