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product & industry news
| | | boyd corp completes acquisition of aavid thermalloy
boyd corporation, a global leader in thermal management and environmental sealing solutions, announced the acquisition of aavid thermalloy.
| | | | ats offers high-resolution thermography system with precise temperature accuracy
thermview from advanced thermal solutions, inc. is a thermochromic liquid crystal based temperature measurement system that performs high-resolution...
| | | | sager electronics announces new director of sales engineering
sager electronics announced the promotion of randal stone, bsee, to director of sales engineering for sager power systems.
| | | | laird active transceiver coolers enable high data transmission speeds
laird has developed a new platform of customizable teas specifically designed for thermal management in sfp transceivers.
| | | | phononic brings high-performance electronics cooling to asia pacific
phononic, the company revolutionizing cooling and heating with solid-state technology, announced it is has expanded its global footprint within the...
| | | | autoneum opens new north america headquarters in michigan
autoneum continues to invest in the automotive market of north america with a new headquarters facility in michigan.
| | | | solvay hyflon pfa enables beijing xinshiyi to develop heat exchanger for power plants
solvay announced that its advanced hyflon pfa fluoropolymer enabled china-based beijing xinshiyi energy conservation and environmental protection...
| | | | glacialtech announces new igloo fr210 series cold forging heatsinks
glacialtech, the diversified lighting and thermal solution provider, announces a new series heatsinks using cold forging technology are ideal for...
| | | | lg innotek mass produces thermoelectric modules for wine cellars
lg innotek announced it has mass produced thermoelectric modules for wine cellars. this
| | | | 1200v sic schottky diodes from littelfuse are first products from new platform
littelfuse, inc., the global leader in circuit protection, introduced the first gen2 series of 1200v silicon carbide (sic) schottky diodes.
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conferences & webinars
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interpack - packaging and integration of electronic and photonic microsystems aug. 29 - sept. 1, 2017 - san francisco, calif. - interpack is the premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronic packaging, mems, and nems. it is the flagship conference of the asme electronic and photonic packaging division... |
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international conference on thermal engineering theory and applications february 25 - 28, 2018 - doha, qatar - the conference main objective is to bring together researchers engaged in the application of experimental, analytical, or theoretical thermal and energy engineering. the suggested topics link between conventional and emerging research areas in thermal energy. papers submitted to the... |
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