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coolingzone tech newsletter 7-21-17 july 21, 2017
top stories
how microdroplets impact dry surface
researchers wanted to see what happens when a microdroplet impacts a dry surface, as it does in spray cooling.
heat sink attachments impact on pcb design
ats posted a pair of articles explaining the importance of heat sink attachment technology in designing a pcb.
graphene testing heads to space
the graphene flagship is preparing for a pair of experiments this fall to test graphene in zero-gravity applications.
controlling heat with quantum observer
researchers demonstrated that a microscopic quantum observer can control thermal and electrical currents in nanoscale.
coolingzone update
national thermal engineer day is on monday, july 24
join engineers across the u.s. to celebrate national thermal engineer day on monday, july 24 to honor the achievements of thermal engineers.
join supplier directory and promote your business
join the coolingzone supplier directory and promote your business to thousands of engineers from across the thermal management industry.
explore coolingzone library for thermal management research
explore the extensive coolingzone library to find loads of research, case studies, and technical articles on all aspects of thermal management.
product & industry news
ats has flow meters and leak detectors for liquid cooling systems
advanced thermal solutions, inc. (ats) has leak detectors and flow meters among its array of liquid cooling products.
siemens and aes join forces to create fluence, a new global energy storage company
siemens ag and the aes corporation announced their agreement to form a new global energy storage technology and services company under the name...
alfa laval wins pair of contracts for heat exchangers
alfa laval, a world leader in heat transfer, centrifugal separation and fluid handling, has won two orders for industrial heat exchangers.
ek is releasing an m.2 nvme heatsink for next generation form factor ssds
ek water blocks, the slovenia-based premium computer liquid cooling gear manufacturer, is releasing a passive heatsink for m.2 nvme next generation...
kaltra announces the second generation of in-row cooling units
kaltra launches the second generation of its high-capacity in-row cooling solution designed for high power density data centers.
itsenclosures introduces the dual screen icestation titan hammerhead computer enclosure
itsenclosures continues to add to the popular titan family with the introduction of the hammerhead ? the new dual monitor nema 12 freestanding...
delta launches innovative outdoor energy storage system cabinet
delta group, a global leader in power and thermal management solutions, launched its outdoor energy storage system (ess) cabinet.
techsil launches new loctite hybrid structural bonders from henkel
techsil ltd of bidford-on-avon warwickshire has announced its distribution agreement with manufacturer henkel and introduces their unique range of...
modine hosts 'a breath of innovation'
modine manufacturing company recently hosted a breath of innovation, a summit aimed at educating participants about new european regulations and the...
swiftech introduces new apogee skf heirloom series
rouchon industries inc., dba swiftech, the leading force in driving the high-end thermal management scene in personal computers, announced the...
technology corner
reducing oxygen stabilizes nonacrystalline materials at high temperatures [coolingzone]
researchers at the university of connecticut (uconn) have discovered that a reduction in oxygen in some nanocrystalline materials could enhance...
lab develops way to spot defects inside hard-to-image materials []
sandia national laboratories studies myriads of low-density materials, from laminate layers in airplane wings to foams and epoxies that cushion...
advanced cooling for power electronics [electronics cooling]
this paper discusses cooling technologies that have evolved in step to remove increasing levels of heat dissipation and manage junction temperatures...
supercapacitor electrodes made faster and cheaper []
a team of engineers at the university of washington thinks they've come up with a process for manufacturing supercapacitor electrode materials that...
darpa seeking a future for electronics beyond moore's law [coolingzone]
the u.s. department of defense has allocated $75 million for the defense advanced research projects agency (darpa) to fund an electronics resurgence...
engineering how to
how to use phase change materials in thermal management of outdoor enclosure
all types of outdoor equipment can be cooled using pcms. most designers like to use passive methods on account of their simplicity and lack of...
how to perform thermal design of fault tolerant computer systems
in a fault tolerant/high availability design, thermal design engineers often make their most critical decisions at the initial stages of product...
how to cool 10 kilowatts of rack servers with water [video]
lawrence berkeley national laboratory did a ?how to? study on liquid cooling for rack level servers. using equipment from asetek, cisco, intel, and...

conferences & webinars
imece - international mechanical engineering congress & exposition
nov. 3-9, 2017 - tampa, fla. - asme international mechanical engineering congress and exposition (imece) is the largest interdisciplinary mechanical engineering conference in the world. imece plays a significant role in stimulating innovation from basic discovery to translational application. it fosters new collaborations...
thermal and fluids engineering conference (tfec)
march 4-6, 2018- ft. lauderdale, fla. - the 2018 american society of thermal and fluids engineers (astfe) conference will be held march 4-7, 2018 at the nova southeastern university in ft. lauderdale, fl. astfe is the premier international society by and for professionals within the thermal and fluids science and...
international symposium on advances in computational heat transfer
may 28- june 2, 2018 - napoli, italy - the objective of the symposium is to provide a forum for the exchange of ideas, methods and results in computational heat transfer (cht). papers on all aspects of cht - both fundamental and applied - will be welcome.

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