to ensure that you receive coolingzone e-news properly,
please add the following domain to your e-mail "safe" list: [coolingzone.com]
web version | send this message to a friend | subscribe |
 |
| coolingzone newsletter for july 30, 2012 |
july 31, 2012 |
|
research
 act now to learn the latest in thermal management technology at coolingzone-12
coolingzone-12 is one of the best places to learn the latest in thermal management and heat transfer technology. click to register and learn with hundreds of engineers about best practice in cfd modeling, accuracy in thermal measurement, advanced materials, liquid cooling and more....
read more |  turbulent models for cfd simulation in electronics cooling
commercial cfd software solves both fluid flow and heat transfer throughout the system, which enable engineers to predict air flow distribution, chip junction temperature, local heat transfer coefficient and heat sink performance, etc. due to the complex geometries of components on pcbs and the...
read more | advanced cooling of electronics using liquid metal as the coolant
in applications where air cooling is not adequate or not practical, liquid cooling can play a significant role. liquid cooling can be achieved either using conventional pumps to run some sort of liquid, such as water/ethylene, or by utilizing liquid metal instead of conventional liquids. using...
read more | technology review of loop heat pipes, 2001 to 2005
in this issue, our spotlight is on loop heat pipes. there is much discussion about their deployment in the electronics industry, and these patents show some of the salient features that are the focus of different inventors.
read more |  | |
|
|
|
| found on the web |
technology corner |
conferences |
|
|
|
|
|
|
|
editor's corner
|
why attending coolingzone-12 is a great idea: from ee times
the team here at coolingzone couldn't have said it any better as to why you should attend coolingzone-12, so, we'll use ee times' words from their review of last year's coolingzone-11 instead:
"nearly every engineer worries system power consumption and availability. many of these engineers also have to worry about the inevitable consequence of this consumption: dissipation. that means cooling and thermal management issues which you can deal with anytime from the design phase (good) to qualification phase (bad) or in the field (very bad).at the 11th international business and technology "cooling zone summit" in cambridge ma, several hundred engineers and academics studied the topic in all of its aspects. tutorials covered all aspects of thermal management of electronics: analysis, modeling, simulation, fluid flow and analysis, corroborated and supported by the latest in advanced measurement techniques, as well as actual cooling components, subsystems, and systems."
if ee times liked coolingzone-11, then you'll love coolingzone-12! read the full article at ee times by clicking "read more" below or click this link to learn more about coolingzone-12 and register: click here to learn more about coolingzone-12 and to register
» read more
|
|
|
|
you are currently registered to receive coolingzone at: ‹email›
if this email was forwarded to you and you would like to request your own subscription
to coolingzone, subscribe now.
unsubscribe from the coolingzone monthly emagazine here.
click here to unsubscribe. |
