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coolingzone newsletter for november 9th, 2012 november 09, 2012
win an ipad at the coolingzone thermal management 2-day short course december 3-4, 6-7
you could be the winner of an ipad at the cfd modeling challenge, part of coolingzone's 2-day short course, with partners advanced thermal solutions and future facilities, december 3,4 in boston, ma and december 6,7 in san jose, ca. early bird pricing saves attendees $300, but you must register by... read more
low profile heat pipe heat sink & green performance characterization for next generation cpu module thermal designs
the cpu power dissipation continues to increase and the number of cpus per server continues to increase for next generation servers. this has resulted in increased data room energy costs associated with supplying additional power to the server, and also cooling the server. typically in the past, if... read more
the energy costs of cooling electronic systems
there’s plenty of talk about the amount of energy a data center uses and how important it is to cool those facilities properly. could the very cooling of those datacenters be better achieved by more energy efficient thermal read more
alternative heat rejection methods for power plants
an analysis of alternative methods of power plant waste heat rejection is presented here as applied to a coal-fired power generation facility in the midwestern united states. considerations for putting some waste heat to good use is discusssed both from the standpoint of improved plant efficiency... read more
product news
surface thermography liquid crystals reveal hot spots in electronic devices
ohmite d series heatsinks provide an innovative solution for smt compatible semiconductors and resistors.
cpi's new econnect(tm) pdus integrate thermal management with intelligent power solutions

found on the web technology corner conferences
  a time-dependent analytical analysis of heat transfer in a pcb during a thermal excursion
  thermal considerations for surface mount layouts
  pcb design and its impact on device reliability
  pressure drop calculation for rectangular channels - part i: laminar flow
  calculating flow rate in an enclosure
  heat sinks in natural convection
  short course: thermal management of electronics - calculations, measurements, simulation, review and selection of cooling options. (boston, ma)
at from03, december 2012to 03, december 2012
  short course: thermal management of electronics - calculations, measurements, simulation, review and selection of cooling options. (san jose, ca)
at from06, december 2012to 06, december 2012
  coolingzone econference: november 28, 2012
at from28, november 2012to 28, november 2012
editor's corner
thermal management of an ipad mini or other tablets and handhelds
such devices as tablets and smart phones have made our lives easier and more efficient. we access information from “the cloud” for work; we grab a review from yelp to eat at a great new restaurant; we sms, bbm or imessage on the fly with others. and all of this keeps us in touch, keep us entertained and keeps us productive. in some cases it might even keep us safe, such as with weather alerts. and all this ease of use takes technology. and all technology generates heat. in larger computers and telecommunications equipment, thermal engineers have space to move the heat off the chips that drive the technology and create the magic. but in a tablet or cell phone what do you do? here’s a few answers on dealing with the thermal mangement of handhelds and tablets.
» read more

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