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coolingzone newsletter for february 21, 2013

february 21, 2013

top stories

microthermal imaging in the infrared
ideas on using infrared imaging for accurate electronics cooling thermal analysis read more

how to water cool your desktop or tower computer
a beginners guide to using water to cool a desktop or tower pc read more

ten stupid things engineers do to mess up their cooling
these 10 cautions will help thermal engineers design better thermal management solutions read more

thermal management of smart phones and tablets
cooling handheld telecommunication products like smart phones and tablets read more

product news
	henkel releases new thermal paste with enhanced thermal conductivity that can reduce contact resistance 20 percent

	emerson network power expands offering of autodesk models with addition of liebert ds precision cooling system

	pcanalyze by k and k asociates is an engineering application used to mathematically model and predict pcb thermal behavior

	jaro's new 80mm x 76mm air mover spins at over 19,000 rpm to create industry leading fan flow

	new thermal interface materials from apnt meet power semiconductors requirements

	alpha novatech announces lpd / md / ub series additional low profile heat sinks

	ats releases heat sink selection tool to cross reference semi conductors to heat sinks [sponsored]

	laird acquires nextreme thermal solutions technology

	semi-therm program announced with executive briefing on the thermal management market [sponsored]

	cd-adpaco announces webinar: best practices for forced convection simulations, part 2 [sponsored]

technology corner

	darpa releases solicitation for icecool thermal-management program for embedded computing (military & space electronics)

	thermal management challenges (and solutions) in telecommunication systems and data centers (purdue university: cooling technologies research ctr)

	novel designs are taking wind power to the next level (mit technology review)

	multijunction solar cell could exceed 50% efficiency goal (phys.org)

	new technique scales up production of graphene micro-supercapacitors (science daily)

engineering how to

	what are fan laws and how do you use them in themal management design?

	how to do electrical temperature measurement using semiconductors

	how to properly understand and apply bernoulli's equation

conferences & webinars

	best practices for forced convection simulations, part 2 (webinar \| 2-21-2013)

	ichta 2013 : international conference on heat transfer and applications (conference \| 3-5-2013)

	semi-therm 29 (conference \| 3-17-2013)

	world conferences on experimental heat transfer, fluid mechanics and thermodynamics (conference \| 6-16-2013)

	asme 2013 summer heat transfer conference (conference \| 7-14-2013)

editor's corner

why is education important in thermal management, heat transfer and electronics cooling?
don't all mechanical engineers get ample traning in this topic at their universities? the answer isn't so simple and is an important reason why conferences, magazines and websites like coolingzone are so important. in this video interview with dr. kaveh azar, a noted worldwide expert in thermodynamics and ceo, founder of advanced thermal solutions and publisher of qpedia thermal e-magazine [qpedia is a media sponsor of coolingzone], he talks about the importance of continuing education and why every engineer should avail themselves of it.
» read more

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