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coolingZONE-15 Thermal Management Summit (Entire Program)

Conference Program

 

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webinars

coolingzone 2015 is a series of live webinars on current topics pertaining to electronics cooling.  this years webinars cover thermal management from wearables through servers, racks up to the data center.


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coolingzone-15 thermal management webinars

  • all are broadcast live, with live q&a with the speakers and panels.
  • archived, recorded presentations will be avaiable after the conference
  • webinar format
  • all times eastern standard time

click here to return back to the coolingzone-15 main page


summit program

tuesday, october 20, 2015


10:00am

to

11:00am

"recent developments in passive 2-phase immersion cooling of computers "

phil tuma, msme   |   3m
technical presentation


passive 2-phase immersion cooling (p2pic) is being explored by 3m and partners as a means of meeting the energy efficiency and power density needs of the computing industry. this presentation will review the comparative merits and operating principles of 2pi. its application for bitcoin mining gives a glimpse of what may be possible when x86 hardware evolves to take advantage of the technology's capabilities. recent cluster-scale deployments with supercomputer hardware have provided valuable insights for future deployments.

 

11:00am

to

12:00pm

"predictive analytics for data center thermal risk and reliability management"

dr. cliff federspiel, ph.d., ceo   |   vigilent
technical presentation

real-time operational data in combination with analytics has the power to reveal previously unseen and unknown weaknesses in a data center. specifically, high temperature events can trigger expensive, emergency truck rolls or sla violations.

this presentation will describe a means of precisely determining the functional cooling redundancy of a facility, show statistical analysis that correlates poor redundancy with high temperature events, and share tools that identify and suggest remediation for rooms – and facilities – at risk.  use of cooling analytics is an important aspect of operational excellence, and is a competitive differentiator for datacenter operators.
 
by combining industry standards for design redundancy and equipment performance with data from a properly monitored data center, it is possible to determine a “score” or metric that identifies low/poor redundancy.  a low score can be caused by three things:  underperforming or non-performing equipment, operator issues, and it problems.  equipment problems are flagged when cooling units aren’t responding to commands or are underperforming according to ashrae 90.1 or corporate standards.  operator issues usually involve manual overrides – both known and unknown - that often reduce cooling capacity in a complex environment.  it problems are identified as overloaded rooms, or rooms in which it load is present but not accomplishing its purpose, i.e. decommissioned but still-powered it equipment.  individually and together, these factors contribute to compromised redundancy, lower reliability, and higher risk.
 
the presentation will describe the science behind the metrics, stepping through a statistical analysis based on data from hundreds of facilities.  the analysis projects that rooms with scores of 0-2 are likely to experience a high temperature event, while rooms with scores below zero (no redundancy) are significantly more likely to experience a high temperature event.  such events result in expensive, emergency truck rolls and painful middle-of-the-night calls.  a tool showing the scoring and identifying specific issues that contribute to the score, along with methods to remediate those issues, will be demonstrated.

 

12:00pm

to

1:00pm


break

1:00pm

to

2:00pm

"thermosyphons:  how to properly size, choose and deploy in electronics cooling"

vineet barot, msc.    |    advanced thermal solutions
short course

thermosyphons and heat pipes are used to transport large amounts of heat over a particular distance by using a two-phase fluid inside a hollow pipe.  the more widely used heat pipe uses a wicking structure to transport the liquid back to the hot end whereas a thermosyphon is a simple hollow tube that uses gravity.  the lack of a wicking structgure make the thermosyphon much less expensive than the traditional heat pipe.  however, because of the integral role that gravity plays in the operation of the thermosyphon, it is only effective when the evaporator is below the condenser.  in this 2 hour short course, we will focus only on the non-looped single tube, how to properly size, choose, and deply for electronics cooling.   various correlations and equations will be used to provide an analytical "toolbox" to attendees.
 

2:00pm

to

4:00pm


break

4:00pm

to

5:00pm

"liquid cooling types for data center computing:  choosing and deploying"

phil hughes, bsc., ceo   |   clustered systems, inc.

technical presentation

currently the data center has been considered separate from the it equipment that is contained within it. while the sole use of air as the heat transfer medium enabled this approach, there are several disadvantages. all of which have a negative effect on the bottom line - increased profitability. liquid cooling can deliver lower costs and higher profitability but requires that users take a much more holistic view of the data center and it equipment it contains. this presentation will present some of the forms of liquid cooling and explains how their applicattion would effect both the data center and the it equipment.

 


summit program

wednesday, october 21, 2015


10:00am

to

12:00pm
"analytical modeling in thermal management design"

dr. kaveh azar, ph.d., ceo   |   advanced thermal solutions, inc.
short course


modeling and simulations are the cornerstone of any successful product launch of electronics products. engineers are faced with three modeling options, analytical, computational and experimental. in this short course, these modeling options are reviewed and their application to a problem domain is discussed. emphasis is on the use of analytical modeling and how it can help with faster decisions earlier in the design cycle.

12:00pm

to

1:00pm

break

1:00pm

to

2:00pm


"comparison of hpc/telecom data center cooling methods by operating and capital expense"


dr. alexander yatskov  |  thermal form and function, inc.
technical presentation


current high-performance computing (hpc) and telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data center cabinets have already surpassed 30 kw per cabinet (or 40.4 kw/m2). it is not an unreasonable assumption to expect that, in accordance with moore's law, power could double within the next few years. however, while the capability of cpus has steadily increased, the technology related to data center cooling systems has stagnated, and the average power per square meter in data centers has not been able to keep up with cpu advances because of cooling limitations. with cooling systems representing up to ~50% of the total electric power bill for data centers, growing power requirements for hpc and telecom systems present a growing operating expense (opex). brick and mortar and (especially) mobile, container based data centers cannot be physically expanded to compensate for the limitations of conventional air cooling methods.

in the near future, in order for data centers continue increasing in power density, alternative cooling methods, namely liquid cooling, must be implemented at the data center level in place of standard air cooling. although microprocessor-level liquid cooling has seen recent innovation, cooling at the blade, cabinet, and data-center level has emerged as a critical technical, economic, and environmental issue.

in this article, three cooling solutions are assessed to provide cooling to a hypothetical, near-future computing cluster.

  

 

2:00pm

to

4:00pm
break

4:00pm

to

5:00pm 


"heat pipe selection and application strategies"

dr. rahul mulinti, ph.d.   |   noren products
technical presentation


heat pipes are heat transferring devices that rely on phase change phenomenon to efficiently manage heat transfer between a heat source and a heat sink. their high effective thermal conductivity makes them ideal for applications where heat needs to be moved across a certain distance with least thermal resistance. heat pipes offer flexibility in terms of functionality across a wide range of heat loads as well as operating temperatures. they can be bent and manipulated to get around geometric constraints that usually restrict the use of traditional heat transferring mechanisms. designing an optimum heat pipe will depend on several parameters that include but not limited to the heat load, operating temperature, orientation and geometry. this paper will outline some of the strategies that can be used to select the right heat pipe for a specific application.

most heat pipes use some sort of wicking structure that enables the liquid to flow from cold end to the hot end due to capillary action of the wick. bending a heat pipe with the wicking structure inside is tricky and traditional tube bending methods can damage the wick. a proprietary process has been developed at noren products inc., which ensures that the wick maintains its integrity during and after the bending process. tests have been conducted to compare the deformation of copper tubes due to bending using traditional methods in the industry and the novel method developed at noren products inc. this paper outlines some of the details as well as the advantages of this process compared to traditional bending methods.


summit program

thursday, october 22, 2015


11:00am

to

12:00pm
"flexible thermal ground planes for smartphones and wearable electronics"

dr. y.c. lee, ph.d.   |   university of colorado at boulder
technical presentation


a thermal groundplane is at least three times as efficient as graphite and ten times as efficient as copper.  this technology is also flexible, ultra-thin, taking up less space in hand helds, wearables, smart phones and other small enclosures that are typical in mobile computing and the internet of things (iot).  
this talk will focus on this technology, and its application.

12:00pm

to

1:00pm

break

1:00pm

to

2:00pm


"how to perform and understand temperature measurement within electronic systems"
 

dr. kaveh azar, ph.d., ceo   |   advanced thermal solutions, inc.
technical presentation

attendees will become familiar with the importance of temperature measurement in electronic systems, the instruments that are necessary and the location within a systems where testing should be conducted. further, salient features of each measurement system and technique will be highlighted, and the most ideal sensors and their placement for accurate temperature measurement will be presented.


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