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coolingZONE-15 Thermal Management Summit (Entire Program)

Pre-Conference Short Course



this year coolingzone 2015 thermal management summit, a live webcast!  is pleased to bring you two short courses. these short courses provide in depth information on their their topics for mechanical engineers.

thermosyphons: how to properly size, choose and deploy in electronics cooling

date: october 20, 2015, 1pm-3pm

short course leader:  vineet barot

thermosyphons and heat pipes are used to transport large amounts of heat over a particular distance by using a two-phase fluid inside a hollow pipe.  the more widely used heat pipe uses a wicking structure to transport the liquid back to the hot end whereas a thermosyphon is a simple hollow tube that uses gravity.  the lack of a wicking structgure make the thermosyphon much less expensive than the traditional heat pipe.  however, because of the integral role that gravity plays in the operation of the thermosyphon, it is only effective when the evaporator is below the condenser. 

in this 2 hour short course, we will focus only on:

  • the non-looped single tube
  • how to properly size and choose
  • consideratinos for deployment for electronics cooling.  

various correlations and equations will be used to provide an analytical "toolbox" to attendees.  click here to register.


analytical modeling in thermal management design 



date: october 21, 2015  10am-12pm
short course leader:  dr. kaveh azar, ph.d.


modeling and simulations are the cornerstone of any successful product launch of electronics products. engineers are faced with three modeling options, analytical, computational and experimental. in this short course attendees will:

  • review the necessity for modeling
  • consider the three ways to perform modeling: integral, computational and experimental
  • consider which modeling is best to use when
  • look at how analytical modeling can be used in place of computational modeling in some instances
  • look at their application to a problem domain
  • emphasis is on the use of analytical modeling and how it can help with faster decisions earlier in the design cycle.

problem domains considered that are analytically modelled include:

  • system level modeling of an electronic enclosure with two shelves fully populated
  • natural convection modeling application for a computer board
  • forced convection modling
  • liquid cooling - cold plate application modeling
  • high capacity cooling for cloud computing servers

analytical modeling is a proven method to accurately speed up thermal design, take this course and learn more about how to do that across a variety of problem domains for electronics cooling.  click here to register.


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