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  • Research team builds thermoelectric device that uses body heat to produce electricity

    A team of researchers from the Electronics and Telecommunications Research Institute (ETRI) in Kwangju, South Korea developed a thermoelectric module that converts body heat into electricity and amplifies it to power wearable devices. details>>
  • Researchers use artificial muscles to build prototype of an air conditioner for the future

    Researchers at Saarland University (Saarbrucken, Germany) created a prototype of a new air conditioner that uses nickel-titanium (nitinol), which is a shape-memory material that releases heat when loaded in a superelastic state and absorbs heat when unloaded. details>>
  • Analysts report that gallium oxide could be cost-effective material for future power electronics

    The National Renewable Energy Laboratory (NREL) in Lakewood, Colo. released the findings from a technoeconomic study of gallium oxide as a potential material for future power electronics and determined that it could be three to five times cheaper to manufacture than silicon carbide (SiC). details>>
  • New liquid cooling solutions for servers debut at Open Compute Project Summit

    According to a report from DataCenterFrontier.com, liquid cooling companies Submer Immersion Cooling and ZutaCore debuted new technologies at the recent Open Compute Project Summit 2019 in San Jose, Calif. details>>
  • Ultrafast lasers allow scientists to weld glass and metal together in new manufacturing process

    Scientists from Heriot-Watt University (Edinburgh, Scotland) demonstrated a new manufacturing process that utilizes an ultrafast laser system to weld glass and metal together, which could impact industries ranging from aerospace to optics to medical. details>>
  • U.K. company producing graphene sheets at scales large enough for commercial electronics

    Paragraf, a company that recently spun-off from the University of Cambridge (U.K.), is producing graphene wafers that are up to eight inches (20 cm) in dimeter, which is large enough for commercial electronics. details>>
  • Article explores recent research into next-gen heat exchangers for electronics cooling

    A recent article from Advanced Thermal Solutions, Inc. (ATS), a leading-edge thermal engineering company based in Norwood, Mass., detailed recent research into heat exchanger technology and the ways that it is being implemented in electronics cooling applications. details>>
  • Engineers develop, inexpensive smart stop sign to improve driver safety on rural roads

    Engineers from the University of Texas at San Antonio (USTA) designed a smart stop sign that uses infrared technology to sense oncoming vehicles and trigger a flashing system to alert motorists about the stop sign. details>>
  • imec unveils new microfluidic, microchannel heat sink for high-performance chip cooling

    At the Embedded World Conference 2019 in Nuremberg, Germany, imec, an international research and development and innovation hub based in Leuven, Belgium, revealed a silicon-based, microchannel heat sink for high-performance cooling of next-generation chips. details>>
  • UVA and Rolls-Royce partner to enhance efficiency of jet engines through thermoelectric materials

    The University of Virginia (UVA) School of Engineering (Charlottesville, Va.) and Rolls-Royce are partnering on a project to make jet engines more efficient by identifying and developing thermoelectric materials that will harness excess energy. details>>
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