Editorial

• CUI introduces higher performing Peltier modules with innovative structure

  The Thermal Management Group at CUI, Inc. announced that it has developed a new line of Peltier thermoelectric cooling (TEC) modules featuring the company's arcTEC structure. details>>

• KULR Technology debuts carbon fiber thermal management material at Semi-Therm 33

  KULR Technology demonstrated new applications for its proprietary carbon fiber thermal management at the annual Semi-Therm 33 conference. details>>

• Kickstarter campaign started for Calyos fanless computer chassis

  Belgian heat pipe company Calyos has started a campaign on Kickstarter for its NSG S0, the world's first fanless chassis for high-performing desktop computers. details>>

• Microsoft releases details about high-powered console with vapor chamber

  Over the past few weeks, details have been released about the latest iteration of the Xbox One gaming console from Microsoft, Scorpio, which will be the most powerful gaming console by far. details>>

• ESA turns to lunar soil to heat overnight missions on the moon

  The European Space Agency (ESA) is exploring innovative methods for keeping lunar missions warm during the frigid periods of night on the moon and the latest concept is to use the lunar soil to store thermal energy that can be used at night. details>>

• Physicists develop ultrathin superconducting plastic film

  Physicists from Saarland University and the Leibniz Institute for New Materials (INM), both in Saarbrucken, Germany, have developed an ultrathin nanomaterial from plastic fibers and high-temperature superconducting nanowires. details>>

• Scientists observe unusual fluid behavior in heat pipes in microgravity

  Scientists aboard the International Space Station (ISS) observed that vapor near a wickless heat pipe condensed into a liquid even when the temperature was 160 K above the normal boiling point of the substance. details>>

• Outlining industry developments in thermal solutions for servers

  Advanced Thermal Solutions, Inc. released an outline of developments in the server, data center, and cloud computing industries for cooling at the macro level and at the device level. details>>

• ARM unveils latest generator of processors focusing on AI and machine learning

  ARM previewed the company's latest generation processor design, DynamIQ, which is focused on providing better connections between wider varieties of CPUs and devices. details>>

• Sandia Labs using refrigerant not water for cooling supercomputers

  Sandia National Laboratories is highlighted for designing a Thermosyphon Cooler Hybrid System for cooling supercomputers that could save as much as four or five million gallons of water per year in New Mexico by avoiding the energy needs of a compressor. details>>