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Event

coolingZONE Short Courses: (SIgn up before July31 for $695 Rate; After it is $795.00)

 
Location: coolingZONE-12 at the Royal Sonesta Hotel, Cambridge MA Date: 28, August 2012 To 28, August 2012

coolingzone attendees may choose from the following short courses.  note: only one course may be taken in the morning and one in the afternoon:

(tuesday short courses  - monday short course click here)

 

last call for coolingzone-12 reduced pricing! 
$695 on this course until august 8th! 
special discount pricing on all coolingzone-12


morning courses:

  • 8am-12:15pm
    • "transitioning from air to liquid cooled: design fundamentals for heat sinks and cold plates" taught by dr. al ortega
      • this half-day short course is intended for the engineer who wants to:
        • become familiar with the market and technology drivers that are exacerbating power consumption and local heat fluxes in semiconductor devices and systems thereby requiring strategic transitioning from primarily air-cooled systems to systems that use liquid cooling. 
        • learn about the generally accepted methodologies, models and correlations useful for conventional and advanced air- and liquid-cooled heat exchangers such as heat sinks and cold plates.
        • become better acquainted with the theory of compact heat exchangers and how it applies to heat sink and cold plate design.
        • know where to find reliable design and validation data, and how to conduct bench-top experimentation when it does not exist.
        • understand how to approach the transition from air-cooled to liquid-cooled systems design at the component, module, and box levels and its implications on the server box-level form-factor including both thermal (heat exchanger design) and hydraulic design (manifold design).
  • 8am-12:15pm 
    • "thermal design of electronic systems for use in data centers" taught by dr. chris aldham
      • the need for thermal design of electronic systems is well understood and many engineers are employed to estimate heat transfer characteristic, simulate using cfd and measure prototypes to ensure optimum thermal performance. thermal design is now being carried out upfront and not just at the end of the design process as an afterthought. however, much of this thermal design work is done with only scant regard for the actual operating environment for the system. often vague guidelines, like 10-35oc (50-95of), will be used to specify the inlet air temperature and the system will be verified to work in these conditions within data centers huge amounts of money are spent to ensure a cool environment for the electronics they house. but thermal problems in data centers are far more common than would be expected considering the effort (and money) expended. why is this? this half-day course will introduce some typical data center cooling scenarios and the guidelines and metrics used to describe the performance. it will discuss the thermal design of electronic systems with specific emphasis on the interaction between the system and its environment.

 

afternoon courses: 

  • 1:15pm-6pm
    •  
      • the need for advanced thermal management and packaging materials is highlighted in many roadmaps. in response, there have been revolutionary advances in the last few years. there are now many low-cte, lightweight materials with thermal conductivities up to 1700 w/m-k (over 4x copper). advanced materials can reduce component and system cost. they can tailor pcb cte, potentially eliminating the need for underfill. they also can increase pcb thermal conductivity. some manufacturers have replaced copper with al/sic in igbt modules, which has “eliminated solder joint failure”, increasing lifetime from 10 to 30 years. there are a large and increasing number of microelectronic and photonic  applications, including: substrates; pcbs; pcb cold plates; heat spreaders; heat sinks; microprocessor, rf and power packages; thermoelectric cooler heat sinks; laser diode and led packages; displays; photovoltaic packaging; detectors; and enclosures. this course covers the large and increasing number of high-performance thermal management materials, including properties, manufacturing processes, applications, cost, lessons learned, typical development programs, and future directions, including carbon nanotubes and graphene and the potential for greatly improved thermal interface materials. the course also discusses traditional thermal management materials, of which many exist.
  • 1:15pm-3:15pm

    • "simulating natural convection-cooled systems in cfd, including led" taught by ruben bons
      • natural convection is the preferred method of cooling for many electronic systems, including leds, due to the inherent simplicity, reliability, size, weight, and power requirement advantages over forced air cooling.  design of natural convection-cooled systems can benefit enormously from the insight provided by flow and thermal simulation, especially when the sensitivity to various design variables is investigated. this short course will examine the approach to simulating natural convection-cooled systems in a cfd program.  particular physical phenomena, their impact on the simulation process, and focused guidelines will be addressed.  specific topics include: the setup of natural convection simulations; most efficient modeling of small sealed air pockets; radiation effects on the thermal performance.  the background theory, simulation details, and design implications of each topic will be presented.
    • 3:30pm-5:30pm
      • "themal characterization and measurement of leds" taught by norbert engelberts
        • in today's electronics industry, there is a constant push to have more functionality in a smaller volume. the dissipated power per function is decreasing, but more and more functions will be put within a smaller volume. ic's, asics, leds are becoming more and more powerful and the thermal load per surface area and volume is increasing. as the result, thermal management of electronics and in particular led has taken the centre stage for their successful implementation. the presentation will discuss the combination of analytical modelling, computational modelling and experimental testing to help the designer to come up with the most optimal solution and how the final product need to be verify by thermal characterisation and measurements and the challenges involved in doing this.


     

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