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coolingZONE-12 Thermal Management of Electronics eConference (August 30th only)

Location: Live Streamed, August 30th only Date: 30, August 2012 To 30, August 2012

coolingzone-12 thermal management of electronics econference program

conference: coolingzone-12 thermal management of electronics econference program
date:  wednesday august 29 and thursday august 30, 2012
time: 9:30am to 5pm est

thursday program
host introduction and opening remarks 

keynote address
state of the thermal management market

alan wong, ph.d.
president and c.e.o, aavid thermalloy, llc.

technical presentation on thermal interface material (t-global technologies)

dr. philip blazdell

 this talk outlines the commercial and technological needs for a new class of thermal interface materials, namely those that are dispensable.  there is much misconception about these materials and how the marketplace needs them presented so this paper will clarify the key thermal, mechanical, rheological and engineering requirements for such materials.  one such possible technical solution will be presented as will some comments on the future directions of these materials

materials for microelectronic and led heat dissipation

deborah d.l. chung, ph.d.
director, composite materials research laboratory

niagara mohawk chair professor of materials research

professor of mechanical and aerospace engineering

university at buffalo, state university of new york

overheating is one of the biggest problems in the microelectronic and led industries, as it limits the power, reliability, performance and further miniaturization. this problem particularly affects high-performance and high-power devices. for heat dissipation from a hot surface, heat needs to flow from the hot surface to a heat sink or a heat spreader. a heat sink is a thermal conductor that has a considerable heat capacity so that it serves as a sink for the heat. a heat spreader is a thermal conductor that serves as a conduit to channel the heat away from the heat source. heat is dissipated from both heat sink and heat spreader to the environment. suitable thermal insulation to avoid the dissipated heat to degrade nearly electronic components is often needed. due to the low thermal expansion coefficient of semiconductors and their substrates, a low thermal expansion coefficient is preferred for the heat sink/spreader; otherwise, thermal fatigue may occur upon temperature cycling. the effectiveness of the heat flow from the heat source to the heat sink/spreader is partly governed by the quality of the thermal contact between the heat source  surface and the surface of the heat sink/spreader. improvement of the thermal contact requires a thermal interface material, which needs to be conformable. conformability is essential due to the need to displace the air from the interface between contact surfaces that are necessarily not completely smooth. as long as the thermal conductivity exceeds that of air, a highly conformable  thermal interface material is able to improve a thermal contact. a heat spreader can be isotropic or anisotropic; the latter has a low through-thickness thermal conductivity but a high in-plane thermal conductivity and has the advantage of providing some degree of thermal insulation so that the heat evolved does not affect the nearby electronic devices. the performance of isotropic and anisotropic heat spreaders depends on both the material and the dimensions, as shown by a heat conduction model.

best practice in thermal design for led lighting

norbert engleberts
director, optimal thermal solutions

speaker confirmed/abstract pending

near junction thermal engineering of microelectronic devices

mehdi asheghi, ph.d.
consulting associate professor, mechanical engineering department, stanford university

speaker confirmed/abstract pending

indirect liquid cooling of electronics with micro- and mini-scale cold plates and heat sinks: theoretical and practical implications for enhanced cooling and energy recovery

alfonso ortega, ph.d.
james r. birle professor of energy technology
associate dean for graduate studies and research
director, laboratory for advanced thermal and fluid systems
college of engineering, villanova university

indirect liquid cooling via cold plates and liquid cooled heat sinks has become a necessary part of the potential design space for cooling electronic systems as the thermal margin for air cooling vanishes. in high density data center applications, liquid cooling offers the possibility not only of enhanced cooling, but also increases the potential for waste energy recovery. as liquid cooled solutions start to seriously contend for implementation, understanding their behavior will lead to better design processes, tools, and ultimately optimized solutions. this lecture will focus on understanding the basic behavior of liquid cooled heat sinks and cold plates, in single and two-phase flow. we will compare the various metrics that can be used to assess their performance, including the overall thermal resistance and the heat exchanger effectiveness. finally, we will discuss the use of analysis tools in their design in particular to show the value of simple modeling approaches compared to full cfd approaches.

state of the art in thermal management - from vacum tube to super computers

kaveh azar, ph.d.
president and c.e.o, advanced thermal solutions, inc.

thermal management,more than ever before, has become the center of attention in a successful launch of a product. the challenge that we all face as product managers or engineers is to select, design or deploy a successful cooling solution suitable for the product at hand while meeting its market requirements. as the result, we often overlook what is available on the market and what has been developed to meet the cooling challenges of different electronics. the range of cooling options varies from natural convection in air to cryogenic cooling – or any other solution that lies in between. in this presentation, the cooling technologies that have been developed across the electronics market sector – ranging from consumer electronics to high capacity computing to military/avionics equipment, will be presented. the use and reason behind deployment of such cooling technologies along with their salient points will be discussed. the presentation will close with the options to exercise when selecting a cooling system while highlighting the best path for meeting the market requirements of a given electronic system.

host closing remarks

presentation times subject to change in the event of unforeseen events. in the event of change, updated schedules will be provided at registration.



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