Event
coolingZONE eConference: December 12, 2012
Location: Webinar
Date: 12, December 2012 To 12, December 2012
coolingzone's econference series feature monthly online training taught by world class experts in thermal management and heat transfer. each month two to three hours of important topics in thermal management, heat transfer, electronics cooling and thermal transport are provided for $99.00 for a month's sessions. these webinar format elearning courses fit well for engineers who need to review and update their skills or for those engineers moving into a new position. the $99.00 fee include an unlimited access to the recorded versions and the speaker notes (when provided by the speakers). this month's econference includes the following topics:
1. dr. clemens lasance: "sense and nonsense of correlations"
generations of mechanical engineers have been educated to use the correlations that fill the textbooks because: “for convenience of engineering applications, correlation equations are developed over the entire range of dimensions and for any pr-number”. the presentation will address the question: “how convenient are these correlations in practice?” the answer is that when it comes to thermal management of electronic systems, correlations are not only rather useless (except when you live in a wind tunnel) but also dangerous because designers trust them blindly due to their aura of science. alternatives will be discussed.
2. dr. carl zweben: "system chassis materials for thermal management: choices and tradeoffs"
are you using the wrong materials for your system chassis design? traditional thermal materials are at least a decade old and can impose major design limitations on system chassis designs. in response to this critical need, an increasing number of advanced materials are being deployed. many of these materials hae ultrahigh-thermal-conductivity with thermal conductivity of 400 to 1700 w/m-k, low coefficients of thermal expansion and low densities. in this talk i'll exlore these issues and new solutions.
3. dr. michael ohadi: "review of emerging cooling options for next gen data centers
investment and growth in data centers is continuing at a rapid pace. in september canadian datacenter operator cogeco cable announed a $100 million new data center to come on line in 2014. in a recent study, datacenter dynamics intelligence found that worldwide investment in data centers for 2011 will have grown from us$85 billion dollars to $105 billion. can we cool all these data centers efficiently enough so that their overall benefit is greater than their cost? in my talk we'll review and discuss emerging cooling options for data centers. we'll consider the tradeoffs and the how-to of such technologies as free air cooling, liquid cooling, dynamic smart-cooling, energy efficiency enhancements in air cooled data centers through cooling advances in metrology