advanced thermal solutions, inc. (ats), a leading-edge thermal engineering and manufacturing company focused on the thermal management of electronics, is pleased to announce that it will be showcasing its new line of liquid cold plates in booth 1738 at apec 2018, the world’s premier event for applied power electronics, being held in the henry b. gonzalez convention center in san antonio, texas from march 4-8.
ats will display its new cold plates that boast an innovative, internal fin array with an optimized aspect ratio, which provides 30 percent better performance than other commercially-available cold plates on the market. the new design also enables ats to rapidly customize cold plates to meet customer needs. ats cold plates are the perfect thermal solution for high-powered electronics, such as igbt, wide-bandgap, and more.
“even as power supplies and power ics increase in efficiency, challenging thermal issues remain,” said steve nolan, ats vice-president of sales and business development. “there is a demand for more power across the industry and ats is committed to supporting the electronics industry with the right solutions in the varied component and end-markets on the market today, whether its cooling for ibgt, emerging wide-bandgap, power bricks, cpus, bgas or more.”
he added, “apec provides us the opportunity to share our solutions with these manufacturers, as well as discuss how we can help with any of their future needs.”
cold plates are part of an array of liquid cooling solutions that ats has to offer power engineers, including heat exchangers with the industry’s highest density fins to optimize heat transfer and a line of chillers for precise control of coolant temperature.
in addition to its liquid cooling solutions for power electronics, ats will also showcase its popular power brick heat sinks, which are based on the patented maxiflow™ spread-fin design and specially designed for cooling 1/8, 1/4, 1/2, and full-brick dc/dc power converters. ats has added a straight-fin option to its line of power brick heat sinks to give power engineers a high-performance cooling option with a smaller footprint for crowded boards.
ats will also showcase samples of its vast array of high-performance flat and round heat pipes, which are perfect for spreading heat away from high-powered components, particularly in boards that have high component-density and little space for other cooling methods.
come to booth no. 1738 at apec 2018 and join steve nolan and product engineering manager greg wong to learn more about the numerous thermal solutions that ats has designed for the power electronics industry.
find more information about ats liquid cold plates, including downloadable data sheets, at https://www.qats.com/products/liquid-cooling/cold-plates.