in an article for electronics weekly, c.t. kao of cadence design systems details the necessity of thermal considerations when designing printed circuit boards (pcb) for internet of things (iot) applications, including automotive (particularly in the era of electric and autonomous vehicles) and in smart phones and smart homes.

thermal management of pcb is critical in iot applications. (wikimedia commons)

“heating resulting from the electric power introduced into the components on a pcb becomes a critical factor as the component size keeps shrinking but the power increases to fulfill the requirements of designs and functionalities,” kao wrote.

when considering the thermal needs of electric vehicles, kao highlighted the complexity inherent in designing boards for power monitoring systems that are required for maintaining fuel efficiency or sensors that connect autonomous vehicles to the outside world and ensure the safety of passengers.

he explained that “heat dissipation paths must be carefully assessed to make sure the effectiveness and integrity of the monitoring electronics, as a portion of the total thermal management of an automotive electronics system.”

smart phones, homes, and even cities also require thermal management to ensure that iot technologies function properly. kao said that it is important for chips to have a “rapidly time-varying power scheme to achieve required tasks, typically in the burst, sustain, and decay operational modes.”

hot spots on aboard, kao writes, could alter sensor readings and the close proximity of components and even multiple pcb could force designers to consider alternative materials or systems to ensure proper cooling.

read kao’s full article at http://www.electronicsweekly.com/news/good-pcb-design-works-iot-2017-01.