design of liquid cooling systems what every thermal design engineer needs to knowthis short course presents a birds-eye view of liquid cooling technology. while liquid cooling is not at all new, most civilian electronics cooling applications have been air cooled for the last couple of decades. what does it take to plan, design, and implement a liquid cooling system where air cooling is reaching its performance limits? what is available in the industry today, and what should customers be asking for? topics will include design considerations for when to switch from air cooling to liquid cooling; interface resistivity and its role in the overall system; data format requirements for cold plate characterization; system level optimization; modeling tools for liquid cooling; and practical implementation of a liquid cooled system. who should attend: thermal design engineers and technology managers who need to get up to speed quickly on the capabilities, requirements, and pitfalls of liquid cooling. an engineering background and familiarity with spreadsheet calculations is assumed. course outline topic 1: from air to liquid cooling: when to switch acoustic noise considerations performance space requirements single phase vs two phase topic 2: interface resistivity requirements at high heat flux current state of the art – what are people doing in practice? where to look for latest developments topic 3: cold plate characterization – performance data requirements power map effects temperature “markers” effective heat transfer coefficient over specific area function of flow rate?! topic 4: system level optimization – liquid loop analysis topic 5: modeling tools & where to use them cfd/fea – chip level: power map, spreader optimization spreadsheet – liquid loop, effective heat transfer coefficient correlations – which ones work for liquids? topic 6: practical implementation hardware requirements connectors, tubing heat exchanger pump control systems; time constants of system components vs control system monitoring time constants instructor: dr. cathy biber | cathy biber, is wearer of all hats in her consulting practice. she has extensive experience in electronics cooling, as well as background in other heat transfer applications like power electronics, digital projection systems, and thermal processing equipment. her career has included stints in the corporate world at ibm, wakefield engineering, and infocus, and in the academic environment at portland state university; she also holds a ph.d. from mit. she enjoys finding creative thermal solutions to address many disparate product design requirements. |
course fee: $795 date:�december 9, 2005 location: sanat clara, ca for registration and more information on the summit visit www.coolingzone.com/liquidcooling |