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August 2018

Epoxy Adhesive Designed for Heat Sink Bonding


The electronics industry is seeking thermal management solutions for electronics that have increased power consumption and complex bonding requirements.

 

The 70-3812NC Aluminum Filled Epoxy Adhesive from Epoxies, Etc. has been specifically designed for bonding heat sinks that require high thermal conductivity and strong structural bonds. Common heat sink bonding applications include fin to base, folded-fin set to base, pin-fin set to base, and cold plate tube to extruded base. 

 

In addition to providing strong bonds and thermal conductivity, the 70-3812NC passes NASA’S outgassing requirements per ASTM E-595-07. 

 

The 70-3812NC is a two-component epoxy system formulated to be cured at room temperature or with mild heat. The 10:1 mix ratio is easy for batch mixing or utilizing Meter Mix and Dispense Equipment.

 

Epoxies, Etc. has been formulating solutions for electronic circuitry and assemblies for over 25 years. Its chemists and engineers are able to provide specific application support. Technical Support can be reached by phone 401-946-5564 or sales@epoxies.com.

 

Samples are readily available and ship within three days.

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