Asetek announced an order from Fujitsu, a leading High Performance Computing (HPC) OEM, for a new cluster in Asia for a global industrial customer.
The installation will be implemented using Asetek's RackCDU™ liquid cooling solution and includes 22 liquid cooled racks populated by compute nodes using Asetek's Direct-to-Chip™ heat capture technology.
"Fujitsu continues to expand its global HPC liquid cooling footprint with another significant installation. We are gratified to see this ongoing success of Fujitsu utilizing Asetek's technology, and delighted to see they are expanding beyond the traditional Government and Education segments" said André Sloth Eriksen, CEO and founder of Asetek.
The order has a value of approximately USD 400,000 with delivery to be completed in Q4 2018. Annual revenue guidance remains unchanged.