TE Connectivity (TE), a world leader in connectivity and sensors, introduced its new Octal Small Form Factor Pluggable (OSFP) connector and cable assembly portfolio, which supports next-generation data center needs with data rates of 200 Gbps and 400 Gbps.
These products are designed to support 8x28G NRZ and 8x56G PAM-4 protocols, with a roadmap to 8x112G PAM-4 for future system upgrades.
TE's OSFP connectors leverage innovative thermal heat sink technology to provide superior thermal performance and the signal integrity that 400 Gbps data rates require. In addition, TE's OSFP products can fit up to 36 400G ports into a 1RU switch form factor, aligned with next-generation switch silicon roadmaps.
"400 Gbps Ethernet is the next big speed upgrade in networking. System designers need high density solutions with high signal integrity and thermal performance," said Zach Galbraith, product manager at TE Connectivity. "Our new OSFP solutions give designers the performance to produce data center system designs that address these next-generation requirements."
"We welcome TE's OSFP connectors and cable assemblies to the growing OSFP ecosystem," said Christophe Metivier, VP of Manufacturing and Platform Engineering at Arista Networks. "These components provide the signal integrity and thermal performance we need to support the full range of 400 Gbps interconnect solutions."
TE's broad OSFP portfolio includes surface mount connectors, 1x1 and 1x4 cages, and straight and breakout passive copper cable assemblies in multiple configurations and various lengths and gauges.
To learn more about TE's new OSFP connectors and cable assemblies, click here.