Log In   |   Sign up

New User Registration

Article / Abstract Submission
Register here
Register
Press Release Submission
Register here
Register
coolingZONE Supplier
Register here
Register

Existing User


            Forgot your password
October 2018

ANSYS Achieves TSMC Certifications for 7nm FinFET Plus Process Technology


ANSYS announced TSMC certified ANSYS solutions for the seven-nanometer FinFET Plus (N7+) process node with extreme ultraviolet lithography (EUV) technology and validated the reference flow for the latest Integrated Fan-Out with Memory on Substrate (InFO_MS) advanced packaging technology.

 

The certifications and validations are vital for fabless semiconductor companies that require their simulation tools to pass rigorous testing and validation for new process nodes and packaging technologies.

 

ANSYS® RedHawk™ and ANSYS® Totem™ are certified for TSMC N7+ process technology that provides EUV-enabled features. Certification for N7+ includes extraction, power integrity and reliability, signal electromigration (EM) and thermal reliability analysis.

 

Industry-leading TSMC InFO advanced packaging technology is extended to integrate memory subsystem with logic die. TSMC and ANSYS enhanced the existing InFO design flow to support the new InFO_MS packaging technology, and validated the reference flow using ANSYS SIwave-CPA, ANSYS® RedHawk-CPA™, ANSYS® RedHawk-CTA™, ANSYS® CMA™ and ANSYS® CSM™ with the corresponding chip models.

 

The InFO_MS reference flow includes die and package co-simulation and co-analysis for extraction, power and signal integrity analysis, power and signal electromigration analysis and thermal analysis.

 

"TSMC and ANSYS' latest N7+ certification and InFO_MS enablement empowers customers to address growing performance, reliability and power demands for their next generation of chips and packages," said Suk Lee, Senior Director of Design Infrastructure Marketing Division at TSMC.

 

"The number of smart, connected electronic devices continues to grow and manufacturers must keep pace to design power efficient, high-performing and reliable products at a lower cost and with a smaller footprint," said John Lee, General Manager at ANSYS.

 

"ANSYS semiconductor solutions address complex multi-physics challenges such as power, thermal, reliability and impact of process variation on product performance. ANSYS' comprehensive Chip Package System solutions for chip aware system and system aware chip signoff help mutual customers accelerate design convergence with greater confidence."

Choose category and click GO to search for thermal solutions

 
 

Subscribe to Qpedia

a subscription to qpedia monthly thermal magazine from the media partner advanced thermal solutions, inc. (ats)  will give you the most comprehensive and up-to-date source of information about the thermal management of electronics

subscribe

Submit Article

if you have a technical article, and would like it to be published on coolingzone
please send your article in word format to articles@coolingzone.com or upload it here

Subscribe to coolingZONE

Submit Press Release

if you have a press release and would like it to be published on coolingzone please upload your pr  here

Member Login

Supplier's Directory

Search coolingZONE's Supplier Directory
GO
become a coolingzone supplier

list your company in the coolingzone supplier directory

suppliers log in

Media Partner, Qpedia

qpedia_158_120






Heat Transfer Calculators