Stäubli will present its industry-defining thermal management solutions at the Supercomputing 2018 (SC18) conference in Dallas, Texas, Nov. 12-15.
At SC18, Stäubli will showcase customizable solutions featuring its non-spill, quick-release couplings that have established it as the industry leader in thermal cooling for electronics, including high-performance computing and data center storage.
Stäubli experts will present different configurations to demonstrate how the absolute tightness offered by Stäubli connectors creates a completely sealed environment to ensure the safety and reliability of a wide variety IT systems.
“The compact design of Stäubli fluid connectors maximizes efficiency and makes them perfect for use in tight spaces, allowing them to be incorporated seamlessly into any installation,” said Roger Varin, CEO of Stäubli North America.“Whatever the application, the fluid composition, or circuit configuration, Stäubli provides a solution.”
For more than 25 years, Stäubli has been a leader in liquid cooling, working in collaboration with the largest and most well-established companies in the industry. Stäubli’s standard and specialized connectors combine performance, safety and durability with a variety of seal types, coupling materials and design options, making them compatible with a wide range of coolants and temperatures.
To meet increased demand, data center operators are increasing the density of units, which increases the amount of heat produced. Because of this, the need for more efficient cooling options for data storage centers has increased dramatically in recent years and will continue to rise at an exponential rate.
Featuring a more compact design than air-cooling methods, thermal cooling presents the ideal solution because of its ability to increase floor space, allowing operators to fit more server racks in a given space, increasing the density of data servers to create more efficient systems.
SC18 is the world’s largest marketplace for high-performance computing and networking professionals, bringing together scientists, engineers, software developers, policy makers, corporate managers, CIOs, and IT administrators from universities, industry and government agencies worldwide.