ATS blueICE, ultra-low-profile heat sinks are lightweight, high-performance options for systems with spatial restraints or low airflow.

In many electronics systems, such as Telecom, Datacom, Biomedical equipment and others, card-to-card spacing is small, yet stringent thermal requirements remain the same. Electronics packages such as BGA, QFP, LCC, LGA, CLCC, TSOP, DIP, LQFP are commonly used with stringent thermal requirements in a tight space with limited airflow.

Ultra-low-profile heat sinks offered by ATS range from 2-7 mm in height and are ideally suited for tight-space application electronics since they offer the best thermal performance. Their thermal resistance is as low as 1.23° C/W within an air velocity of 600 ft/min.

blueICE™ heat sinks are very lightweight, ranging from 4 to 30 grams. No mechanical hardware is needed to mount them to components. A double-sided, thermal conductive adhesive tape can be used to attach a blueICE heat sink securely. This feature reduces weight and assembly time, while saving valuable board space.

blueICE™ Ultra Low Profile Features & Benefits

• blueICE™ heat sinks feature an ultra low profile for tough-to-cool applications
• Designed for high performance in low air velocities
• Ideal for telecommunications applications where space is limited
• Comes pre-assembled with high performance thermal interface material