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John O | June 2017

Higher thermal software needs could mean move to the cloud


computational fluid dynamics (cfd) software was initially created in the 1980s, according to a recent article from new electronics, to be used in the nuclear and aerospace industries before being incorporated into the design processes of everyday electronics.

 


cfd simulations are requiring faster processing and
that could forced a move from desktop to the cloud.
(wikimedia commons)

 

as the thermal challenges of modern electronics devices (increased power demands in smaller packages) become more and more difficult to manage for engineers and designs become more and more intricate, there is a corresponding need for more computing power to handle simulations and a closer connection between cfd and cad (computer-aided design) programs.

 

this could prompt a move away from desktop-based packages to cloud-based processing, according to chris aldham, a product manager at 6sigmaet, who spoke with new electronics for the article.

 

aldham explained that there are challenges to creating thermal management software today.

 

he said, ““one is the price of the equipment being developed. at one time, people thought about the ‘engineering margin’ – products were over designed, but engineers knew they would work. today, people want to work on the limit, producing something that ‘just works’, rather than over engineering. today’s products don’t have to last 20 years, but they still have to work.

 

“that means designers need to be more accurate because the power going into electronics has grown, more heat is generated and the packages are smaller.”

 

read the full interview with aldham at http://www.newelectronics.co.uk/electronics-technology/thermal-challenges-prompt-move-to-the-cloud/156382.

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