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March 2019

Indium Launches Die-Level Bonding Solder Composite


Indium Corporation has launched InFORMS ESM02, a reinforced matrixed solder composite specifically designed to produce consistent bondline thickness for die-level attach applications.

 

Indium Corporation’s InFORMS ESM02 is a reinforced solder fabrication that produces a high-reliability solder joint with increased thermal and mechanical performance.

 

Until recently, InFORMS technology was only applied at the baseplate level. New production capabilities have expanded its use to the die-level with a bondline of 50μm.

 

Other benefits of InFORMS include:

 

  • Drop-in replacement for other bondline control methods
  • Increased lateral strength
  • Bondline co-planarity
  • Improved thermal cycling reliability
  • Available in ribbon and preforms

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