Indium Corporation has launched InFORMS ESM02, a reinforced matrixed solder composite specifically designed to produce consistent bondline thickness for die-level attach applications.

Indium Corporation’s InFORMS ESM02 is a reinforced solder fabrication that produces a high-reliability solder joint with increased thermal and mechanical performance.

Until recently, InFORMS technology was only applied at the baseplate level. New production capabilities have expanded its use to the die-level with a bondline of 50μm.

Other benefits of InFORMS include:

• Drop-in replacement for other bondline control methods
• Increased lateral strength
• Bondline co-planarity
• Improved thermal cycling reliability
• Available in ribbon and preforms