MaxLinear, Inc., a leading provider of radio frequency (RF), analog and mixed-signal integrated circuits for the connected home, wired and wireless infrastructure, and industrial and multimarket applications, will showcase its latest power management products at booth 302 at the Applied Power Electronics Conference (APEC) in Anaheim, Calif. from March 18-20, 2019.
The company is known for providing robust, high density power solutions offering a wide input voltage range and excellent thermal performance.
Among the products demonstrated at the MaxLinear booth is the new MxL7213 dual 13A or single 26A power module. This complete switch mode DC/DC power supply includes a wide 4.5V to 18V input voltage range and offers better efficiency and thermal performance than the competition. The MxL7213 and the previously released MxL7204 dual 4A power module target industrial, telecommunications, networking and infrastructure equipment.
The MxL7213 dual step-down power module integrates the control, drivers, bootstrap diodes, inductors and MOSFETs in a single package for point-of-load supplies. The MxL7213 supports two outputs each with an output voltage range of 0.6V to 5.3V, set by a single external resistor. The MxL7213 requires just a few input and output capacitors which simplifies design and shortens time-to-market.
The module supplies either two 13A outputs, a single 26A or up to 100A when paralleled with additional MxL7213 modules. Attention to thermal design, component selection and internal construction results in higher efficiency and extended operating range relative to devices with the same industry standard pinout.
“The MxL7213 is our highest output current power module solution to date,” said Joseph Tseng, MaxLinear Director of Marketing, Power Management. “It is the latest addition to our growing family of current mode, dual channel LGA/BGA power solutions targeted at networking and industrial equipment such as optical routers and test equipment. Our dual power modules offer system designers significant advantages over competing devices such as improved efficiency and better thermal performance.”
To see a live demonstration of the MxL7213 thermal performance and learn more about our DC/DC power management solutions, visit MaxLinear’s booth 302 at APEC 2019.
The MxL7213 is available now in two space-saving and thermally enhanced packages: a 15mm x 15mm x 4.41mm LGA package and a 15mm x 15mm x 5.01mm BGA package with RoHS compliant terminal finish. Samples and evaluation boards are available.
For more information, visit https://www.maxlinear.com/mxl7213.