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March 2019

ATS continues monthly series with webinar on limits of air cooling and growth of liquid

Advanced Thermal Solutions, Inc. (ATS), a leading-edge thermal engineering and manufacturing company focused on the thermal management of electronics, is pleased to announce the next topic in its series of monthly, online webinars covering different aspects of the thermal management of electronics will be “Limits of Air Cooling and the Role of Liquid Cooling in Growing Thermal Demands.”


The hour-long, live webinar will be presented by Kaveh Azar, Ph.D., the co-founder, president, and CEO of ATS and a world-renowned expert in the thermal management of electronics.


The next webinar will be held on Thursday, March 28 from 2:00-3:00 ET. There will be time allotted at the end of the webinar for questions and answers with Dr. Azar.


Whether the chassis is 1U, 2U, blade, ATCA, VPX, microTCA, Open Compute Project designs, or computing sleds, chassis designs, and standardization of certain chassis sizes and form factors form the application structure for designing new systems. Various markets are standardizing around a chassis design to recognize the benefits of economies of scale in both product availability and deployment in the field.


However, as the physical design of a chassis becomes standardized, the power dissipation occurring inside is far from standardized. For example, an ATCA enclosure designed for 1kW and managed by air is now being considered for electronics that can dissipate in excess of 2-4 kW.  Server racks in datacenters can approach 10kW.


Obviously, if a chassis’ physical design is not changing and it is suitable for the initial power dissipation – the dissipation from both the current and forecasted cards can strain the enclosure’s cooling capacity.


The lingering questions are: What cooling technology is suitable for higher power dissipations?  Will standards need to change in order to address the cooling requirements of future systems? In this webinar we will consider the limits of the most commonly used cooling method, air, and the role of liquid cooling with the growing thermal demands of today’s various high-power systems.


This series will be perfect for experienced engineers as well as those just starting out in the industry.


The full list of upcoming webinars and their respective dates is as follows:


  • Thursday, April 18 - Using Thermal Interface Materials to Improve Heat Sink Thermal Performance
  • Thursday, May 16 - How to Perform and Understand Temperature Measurement within Electronic Systems



Each of the webinars will be presented live through GoToMeeting. For full descriptions of each of these webinar topics or to register for the upcoming webinar, visit https://qats.com/Training/Webinars.

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