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John O | July 2017

Startup receives funding to expand 3-D printing of thermal technologies


australian-based additive manufacturing startup conflux technology has received a significant investment from am ventures holding gmbh (amv) to continue expanding and developing its metal manufacturing, focused primarily on thermal management technologies.

 


conflux technology is 3-d printing its new heat exchanger.
(conflux technology)

 

the partnership will launch the patent-pending conflux coretm heat exchanger that the company said “has broad industry applications and represents the next generation in high efficiency thermal management technologies.”

 

conflux ceo and founder michael fuller said, “the advent of metal additive manufacturing is a global phenomenon.  with metal am growth running at 40% cagr, conflux technology is perfectly positioned to assist businesses across multiple industry sectors realize this potential. 

 

“the conflux coretm heat exchanger technology is the perfect demonstration of our capabilities, and now, with the support from our partners am ventures and technical leadership of eos, we look forward to expanding our reach and facilitating the growth of additive manufacturing.”

 

fuller spoke with 3dprintingindustry.com after the announcement and noted that the new heat exchanger will initially be applied to the aerospace and automotive industries with chemical processing, oil and gas, and high-performance computing on the horizon.

 

the article added, “the 3d printed heat exchangers leverage the geometric freedom and structural efficiency that comes from am. made using eos m290 & m400 additive manufacturing machines the devices have a high surface area density and optimized fluid pathways.”

 

according to the conflux website, the new heat exchanger has “enhanced surface area density to volume ratio results in high thermal exchange performance,” has significantly reduced the weight, has optimized flow to reduce pressure drop and enhance pump efficiency, and can adapt the topology to fit specific applications.

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