Aismalibar announced their first exhibition at the 2019 Thermal Materials Summit in Los Angeles, California.
The Thermal Materials Summit educates attendees on the latest advancements in thermal interface materials for professionals working in markets such as: aerospace, electronics packaging, automotive, semiconductor/ICs, LED cooling, motor controls, power supplies, discrete electronic devices, telecom and batteries.
Aismalibar showcased the following products:
Cobrithem insulate metal substrates are produced with different thicknesses of aluminum and copper and can be clad with different mixtures of dielectric layers to meet the ever-changing demands of the industry. The material can be produced in a variety of styles ranging from very thin layers as small as 50 microns to grant an excellent thermal impedance and up to 130 microns, which allows it to withstand high insulation in between the conductive metal layer.
Cobritherm Ultrathin integrates an innovative ultra-thin dielectric layer that provides higher thermal performance, excellent working temperature and reduces thermal resistance. The new Cobritherm Ultra Thin 4W features a Tg of 180ºC and an 150ºC MOT. Corbritherm Ultrathin offers industry leading thermal conductivity, strong MOT values, high Tg and low CTE which are the key elements for performance of MPCBs operating at high temperatures.
Fastherm is a unique product developed to achieve a faster thermal transition from the LED thermal pad to the heat sink through a pedestal technology. This superior thermal transition can be achieved by using the entire Cobritherm HTC product range with using a copper base. By using Aismalibar Cobritherm HTC range together with Fastherm technology, LEDs operate at a temperature 30ºC to 50ºC lower due to the direct thermal transition (pedestal) from the thermal pad to the heat sink.
Flextherm is a high technology thermal IMS for use in the production of conformable metal printed circuit boards that can be bent without compromising the initial dielectric strength between conductive layers. Its low thermal impedance allows the dissipation of temperature from the heating elements of a PCB into Flextherm’s metal core at an extremely efficient rate.
As thermal management becomes more challenging on multilayer PCBs constructions, Aismalibar has developed different substrates that can be combined to offer tailored solutions. These substrates are required in the case of complex boards with denser circuitry.