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John O | October 2017

Interview outlines developments in copper plating for thermal management

patty goldman of i-connect007 recently posted an interview with dr. albert angstenberger, global technology manager for metallization with macdermid enthone electronics solutions, who had delivered a paper at smta international on the development of copper pillar plating systems, which outlined the thermal management benefits that they provide.


the interview discusses copper plating in thermal management.
(wikimedia commons)


the paper, according to angstenberger, was about the development of new plating chemistry for electroplating, copper metallization of pcb and organic substrates to cope with the heat that modern electronics create.


“it's all about our company's strategies, technical strategies, what we do to develop suitable plating chemistry for successfully copper-plating very tiny through-holes, and a very tiny bump-up to microscopic through-holes,” he continued.


angstenberger said that the two primary goals of the copper plating were getting the heat away from the die, through the substrates and pcb and into the environment and also providing fast interconnections.


“right now, our whole industry is in a very good technological position to provide very fast, very short tracks for signal propagation, as well as to get away the heat,” he added. “this doesn’t just relate to the high-frequency applications but also to simple technological applications like leds, for instance.”


read the full interview at http://pcb.iconnect007.com/index.php/article/106941/strategies-for-developing-copper-plating-systems/106944/?skin=pcb.

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