By Josh Perry, Editor
According to a recent reports, including one from WCCFTech.com, there are rumors circulating among Taiwanese forums that Intel is preparing an addition to its Comet Lake-S processor family, which would include 10 cores on a 14 nanometer die.
Rumors are starting about a potential 10-core processor from Intel in the next year. (Wikimedia Commons)
Obviously, as these are only rumors, details are limited at this stage.
As the WCCFTech.com report explained, “There are no other details mentioned except a mention that the CPU may use a dual ring bus interconnect. Now a single ring bus can definitely handle 10 cores, even more since it allows it but this would be an interesting change if Intel does go with the dual ring design considering their core to core latency has been on point for a while on the mainstream side compared to the competitors who rely more aggressively on interconnects due to cores allocated to dual dies, hence slightly affecting the latency speeds.”
Adding more components to a single die means more power and a lot more heat that will need to be dealt with. The reports indicate that liquid cooling will most likely be required as the heat fluxes will be too high for air cooling to manage.
Look out for more details and possibly a new processor to be coming out in 2019.