make plans to attend the 2006 north american icepak summit - the meeting of the minds in high-performance electronics cooling - may 22-23 in monterey, ca. this event is for engineers and managers looking to share ideas on how to enhance the use of thermal modeling within their electronics cooling design processes. come and see the newest applications and approaches using icepak, icepro, iceboard, icechip, and icewave. learn about upcoming developments in these products, as well as new products that will be released in the coming months. to register, log on to: http://icepaksummit.icepak.com/
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