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John O | January 2019

Article describes innovative cooling solution that enabled shrinking of buck regulator


By Josh Perry, Editor
[email protected]

 

A recent article from Power Electronics described how Analog Devices used an innovative cooling and packaging solution to shrink the size of its LTM4700 Power µModule regulator, which is a step-down DC/DC power regulator with PMBus interface.

 


Analog Devices recently released a new power regulator that used innovative packaging to reduce the size. (Analog Devices)

 

As the article, written by Power Electronics editor-in-chief Sam Davis, noted, the design required attention to both the electrical and mechanical aspects of the regulator to allow it to work as Analog Devices intended.

 

The package was overmolded so that electronics could be inserted along with cooling components.

 

“The company designed the regulator’s two inductors with a special case that helps to cool the nearby MOSFETs on the circuit board,” the article explained. “Miniature copper piping and a cold plate aid in removing conducted heat from the device. When the design was completed, thermal modeling and many thermal photos were taken to ensure it was cooled adequately. And, the package is shaped so that forced-air cooling can effectively cool the µModule.”

 

Utilizing this cooling technique allowed the module to be packaged in a 15 x 22 x 7.87 mm BGA format and allows it top operate at 73°C. Most modular solutions, according to the article, run at 90°C. It also allows eight devices to power a load of 800 amps.

 

“The LTM4700 is a highly integrated component-on-package design that includes onboard memory, data-conversion circuitry, and digital interface, packaged in a way that produced a device nearly half the size of similar devices,” the article continued. “When installed in a data center, this smaller power source will increase server density, which can boost throughput and computational power. And, the power source will have minimal impact on system size and cooling costs.”

 

Read more about the design of the LTM4700 Power µModule regulator in the product announcement from Analog Devices: https://www.analog.com/en/about-adi/news-room/press-releases/2018/11-12-2018-analog-devices-high-power-umodule-regulator-eases-data-center-cooling-requirements.html.

 

Also, watch the video from Analog Devices below:

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