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Sharon Shepard | April 2006

Flomerics Establishes Thermal Test Lab After T3Ster Acquisition


flomerics establishes thermal test lab after t3ster acquisition

flomerics, the leader in thermal simulation of electronics systems and components, has announced that it will be offering the t3ster (pronounced trister) thermal testing system and other testing products gained through its acquisition of micred. the t3ster tester is unique in its ability to test up to eight components at one time and analyze the results as the test is being performed so the results are immediately available. flomerics is also establishing a physical testing laboratory in silicon valley and will be providing physical testing services on a project basis. flomerics will be demonstrating the t3ster and its other products in booths 10 and 11 at the semi-therm exhibition on march 14 and 15, 2006 in dallas, texas. flomerics has also announced that gary meltzer will be joining flomerics in sales and yan zhang in engineering support specifically to sell and support the t3ster product and other micred products.

"as the leader in thermal simulation with greater than a 50% market share, we are excited about introducing our first physical testing product," said dr. mike reynell, director of marketing for flomerics. "the t3ster complements our flotherm thermal simulation software by providing physical testing measurements that can be used to validate a simulation model or measure the quality of a manufacturing process. unlike competitive products, the t3ster can measure up to eight operating devices at a time and with an extension box can both power and measure eight devices simultaneously. the t3ster significant higher accuracy than competitors as demonstrated by a figure of merit (signal to noise ratio divided by thermal resistance) rating of 10 kilowatts per degree."

the t3ster provides nondestructive dynamic thermal characterization of packages semiconductor devices such as diodes, bjts, j-fets, mosfets, thyristors, power leds, mcms and other electronic and mems components. the t3ster also characterizes printed wiring boards and other substrates or thermal interface material and cooling assemblies with dedicated fixtures and software. t3ster carries out measurements in real time, resulting in very accurate, noise-free thermal transient curves at a resolution of 1 microsecond. unlike most other thermal testers, t3ster measures thermal impedance curves rather than artificially composing them from individual responses given to heat pulses.

the t3ster automatically derives the descriptive functions from the thermal transient response of the packaged semiconductor device. these include: the time-constant spectrum, the pulse thermal resistance diagrams, the complex loci of the measured responses, the integral structure function and the differential structure function. structure functions enable the tester to locate failures in the junction-to-ambient heat flow path such as die attach voids, soldering defects, disintegrity of cooling assemblies, etc.

the new experimental test facility in flomerics silicon valley office in santa clara, california, will provide thermal design services from initial concept feasibility to design validations. the experimental services provided by flomerics at this new facility will include power measurements; pressure drop measurements of boards, power supplies, and chassis; fan performance measurements with the wind tunnel; component case temperature measurements; airflow velocity measurements using a hot wire probe; component junction temperature measurements; jedec compliant thermal resistance measurements and dynamic characterization; and nondestructive structural analysis of the junction-to-ambient heatflow path.

for more information, visit the t3ster (

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http://www.micred.com/prodserv/products/measdev/t3ster/) and flomerics (http://www.flomerics.com) web sites.

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