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John O | February 2019

DesignCon 2019 announces winner of prestigious Engineer of the Year award


By Josh Perry, Editor
jperry@coolingzone.com

 

According to a press release from the conference, Intel engineer Vishram Pandit has been named the Engineer of the Year by DesignCon 2019, a conference for chip, board, and systems engineers held in Santa Clara, Calif.

 


Intel’s Vishram Pandit was named the DesignCon 2019 Engineer of the Year.
(Advanced Thermal Solutions, Inc.)

 

Pandit is an SoC Platform Architect at Intel, according to the press release. He has more than 20 years of experience in electronics engineering, particularly focused on improving system power delivery spanning PCB, packaging, and chip-level infrastructure.

 

“At Intel, Pandit leads and provides technical guidance on developing various new PI/SI methodologies that support spec development, optimization, area savings, Platform BOM cost reduction, and product quality improvement,” the release continued.

 

He has worked on new methodologies in on-chip power integrity, system-level power integrity impact, and signal/power integrity. He is the co-author of the book, “Power Integrity for I/O Interfaces: With Signal Integrity/Power Integrity co-design.” He also presented “Electrical Integrity for LPDDR5 Memory Technology” at this year’s DesignCon.

 

“The finalist judges were extremely impressed with the quality of entries we received this year for the Engineer of the Year Award. Vishram Pandit’s dedication for advancing the industry rose above the rest in our open voting. Specifically, impressive was his instrumental role in the development of new PI/SI methodologies that significantly changed how the industry operates,” said Naomi Price, conference content director, UBM. “Pandit’s contributions to the field of engineering have been nothing short of remarkable and it is a privilege to grant him this well-deserved recognition.”

 

The award finalists were selected by the editors of Design News and the winner was chosen by the DesignCon community. The award was presented at DesignCon.

 

“I’m deeply honored to receive the Engineer of the Year award from such a well-respected institution and also to get the opportunity to contribute to the communities that supported me along my engineering path,” said Pandit.

 

Learn more about the award at https://designcon.com/engineer-of-the-year-award.

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