By Josh Perry, Editor
[email protected]

In the latest article from Advanced Thermal Solutions, Inc. (ATS), a leading-edge thermal engineering company based in Norwood, Mass., a novel air jet impingement design for cooling 1U systems is highlighted and its thermal performance is detailed.

Cooling high-powered 1U servers requires new thermal management techniques, including advanced air jet impingement. (Wikimedia Commons)

ATS engineers described the effect of Therm-Jett™ on a 1-2 kW 1U chassis designed for telecom and server applications. Lab tests showed that four heat sinks on four chips on a PCB reached a thermal resistance of 0.16-0.18°C/W, which was 20-40% better than those same heat sinks with parallel flow.

“The new ATS Therm-Jett^™ technology uses a specially made duct with an impingement plate beneath it to create jet impingement on top of the components and heat sinks,” the article explained. “The tremendous increase in heat transfer coefficient leads to significant reduction of thermal resistance compared to the other conventional 1-U systems.”

Therm-Jett™ can be built for specific configurations. The duct is less than 5 mm thick and located in the chassis on top of the motherboard. Unlike conventional fan systems where the air heats up downstream of high-powered devices, Therm-Jett™ provides fresh air close to the base of each heat sink to enhance its cooling power.  

“It should be noted that the above experiment was done for a heat source that is the same size as the heat sink base; hence, the spreading resistance is zero because it is almost independent of the heat transfer coefficient. The spreading resistance can be added to the above numbers for other sizes of heat sources.”

Read the full article at https://www.qats.com/cms/2019/04/11/application-of-air-jet-impingement-for-cooling-a-1u-system to learn more.