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John O | June 2019

Summer program created for undergrads interested in learning about thermal management


By Josh Perry, Editor
jperry@coolingzone.com

 

The McKelvey School of Engineering at Washington University in St. Louis, Mo. will offer a summer research program starting this year for undergraduate students interested in learning more about thermal management, according to an announcement from the school.

 


Summer research at the McKelvey School of Engineering.
(Whitney Curtis/Washington University)


The program, which is supported by a three-year, $367,000 grant from the National Science Foundation (NSF), is designed for juniors and seniors from where STEM research opportunities are limited and will be 50 percent women and 30 percent students from “groups traditionally underrepresented in the STEM fields, including those with disabilities.”

 

Faculty and researchers from the university’s departments of mechanical engineering and materials science and energy, environmental, and chemical engineering to provide an interdisciplinary exploration of heat transfer.

 

“During the 10-week program, students will begin with a four-day heat transfer boot camp taught by Boyd and J. Mark Meacham, co-principal investigator and assistant professor of mechanical engineering & materials science,” the announcement explained. “Participants will then complete research projects with one or more of nine McKelvey Engineering faculty mentors, including Boyd and Meacham.”

 

There will also be lunch meetings with faculty members, research skills workshops, information sessions on graduate school, tours of local research facilities, and presentations by engineers in the field.

 

“In addition, students will serve as teaching assistants for an engineering course for students in the university’s College Prep program for local high school students from underserved backgrounds,” the announcement continued. “The experience will end with a research symposium, where students will present their research.”

 

Two participants will present research at the American Society of Mechanical Engineers International Mechanical Engineering Conference in the fall.

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