By Josh Perry, Editor
[email protected]

AM Metals, TheSys, and EOS (Electro Optical Systems) have teamed and used additive manufacturing techniques to fabricate thermal management components that meet the high-power demands of gaming CPUs but in much smaller packages.

The CPU cooler that was fabricated by EOS additive manufacturing technologies.
(EOS/LinkedIn)

According to a report from EOS that was posted on LinkedIn, AM Metals designed a new CPU cooler that would fit into gaming systems, TheSys ran thermal simulations to optimize the design, and EOS built a cooler that will meet the required thermal performance. Fabrication took only a few hours to complete using the EOS M290.

“The result is a CPU cooler which operates at the same cooling performance but requires 81% less space than the original design,” the report explained.

The goal is to make expand this process and this technology beyond the CPU cooler market and also design solutions for LED, lasers, autonomous driving, power electronics, and other applications requiring high-power dissipation in small form-factors.

A white paper on the project is in the works. For more information, visit https://www.linkedin.com/pulse/how-innovate-gaming-cpu-cooler-additive-manufacturing-matthias-hoeh.