topic include:

• emerging thermal management technologies for future high performance multi-functional microsystems
• nanotechnology for electronics thermal management
• advanced thermal management and packaging materials
• strategies for high performance air cooling
• design and implementation of robust liquid cooling systems
• do’s and don’ts of thermal analysis of electronic parts and systems
• flow simulation using macroflow and tileflow
• ultra compact heat exchangers for thermal management of electronics systems
• high performance capillary evaporator
• managing package and board-level details in thermal modeling
• characterization and optimization of microrefrigerators for hot spot cooling using transient thermal tester (t3ster�)
• innovative thermal management of cooling flip chip packages
• airside thermal management with synthetic jets
• embedded thermoelectric coolers mitigate hot spots in integrated circuits
• thermal management systems for high availability telecommunications
  products
• thermal materials for the emerging fb-dimm technology

in addition to presentations by recognized authorities, we are going to have many technology providers to talk about their solutions and display them in our exhibition area. you will learn about everything that is new in the field.

this year's summit will be held from august 16-18 at the crowne plaza hotel in natickm massachusetts (about 20 miles west of boston).

the registration for the summit 2006 has already begun. register before july 15, 2006 and save $300

for more information and registration go to

www.coolingzone.com/summit2006