Log In   |   Sign up

New User Registration

Article / Abstract Submission
Register here
Register
Press Release Submission
Register here
Register
coolingZONE Supplier
Register here
Register

Existing User


            Forgot your password
April 2013

Thermacore division k Technology Highlights Encapsulated Graphite for Thermal Management


among its primary thermal solutions, k technology, a division of thermacore, developed the patented k-core heat transfer system, which uses encapsulated graphite to help alleviate heat in high-power electronics for applications in aerospace, military and commercial applications. the k-core material uses apg ( annealed pyrolytic graphite  - as an insert within an encapsulating structure. k-core can be fabricated by employing most conventional thermal management materials as the encapsulant (e.g., aluminum and copper alloys, ceramics, and composites), as dictated by user need and application. light in weight, the passive k-core system is highly conductive thermally and offers designers the ability to tailor coefficients of thermal expansion (cte) if needed. the k-core heat transfer system is typically designed for a specific application by our experienced engineering team.

because k-core can be encapsulated in a wide range of conventional thermal management metals and materials, k-core heat transfer products provide “drop-in” replacements for the solid metal conductors. as a result, thermal designers can significantly reduce their electronic component temperatures, thereby improving performance, reliability and greatly prolonging the life of your most valued electronics systems.

k technology’s products are used in aerospace satellites, avionics and military aircraft such as the f-35, f-22 and f-16 fighter planes. k technology thermal management products also cool high power density electronic packaging, power electronics and other applications requiring high-performance heat transfer.

the k-core product line

  • patented encapsulated apg material system has three times the conductivity (k) of copper with the mass of aluminum
  • apg graphite provides a high k path
  • encapsulant sets the cte and structural properties
  • encapsulant material is selected to satisfy requirements
  • drop-in replacement for conventional conduction solutions


for more information:

please contact a thermacore technical representative or e-mail [email protected] for more information on our thermal solution technologies.   you may also visit the k-core product page at thermacore.

Choose category and click GO to search for thermal solutions

 
 

Subscribe to Qpedia

a subscription to qpedia monthly thermal magazine from the media partner advanced thermal solutions, inc. (ats)  will give you the most comprehensive and up-to-date source of information about the thermal management of electronics

subscribe

Submit Article

if you have a technical article, and would like it to be published on coolingzone
please send your article in word format to [email protected] or upload it here

Subscribe to coolingZONE

Submit Press Release

if you have a press release and would like it to be published on coolingzone please upload your pr  here

Member Login

Supplier's Directory

Search coolingZONE's Supplier Directory
GO
become a coolingzone supplier

list your company in the coolingzone supplier directory

suppliers log in

Media Partner, Qpedia

qpedia_158_120






Heat Transfer Calculators