on the evening of the first day on august 22nd, several free workshops are provided by our suppliers at no additional cost. the following is a list of these workshops:
how to pump more heat and use less electricity: cooling electronics with thermoelectrics
one of the biggest downsides of many thermoelectric cooling solutions is that almost as much heat is produced as is removed. bsst’s scientists have taken the results of 5 years of research and applied it to electronics cooling to solve this problem. bsst has created advanced designs to reach a cooling capability that is twice that of standard thermoelectric cooling systems. this presentation will cover how the technology works and how it can be applied to particular applications. audience questions and participation are strongly encouraged.
darrell park, bsst llc
macroflow™ – a productivity tool for system-level thermal design of electronic equipment
innovative research will present macroflow, an easy-to-use and computationally efficient software based on the flow network modeling (fnm) approach for rapid system-level thermal design. macroflow has an integrated graphical user interface (gui) and a powerful solution methodology for quick construction of the network models, rapid solution, and a comprehensive examination of results. macroflow contains an extensive library of components with built-in flow and thermal characteristics, and comprehensive vendor databases for accurate prediction of systemwide flow and temperature distributions in a variety of electronics cooling systems. use of macroflow for system-level thermal design results in significant productivity improvements and a shorter design cycle. macroflow is widely used for thermal design of air- and liquid-cooling systems in all major computer, telecom, and defense electronics companies. during the workshop, an overview of the technique of flow network modeling (fnm) will be provided. this will be followed by a demonstration of macroflow for the analysis of a practical electronics system. finally, a variety of case studies involving the use of macroflow for thermal design of air- and liquid-cooling systems for servers, telecom cabinets, avionics, and peripherals will be discussed. kanchan kelkar, innovative research, inc.
airflow measurement techniques: an introduction to thermal and airflow measurements.
this will lead to a focused discussion on airflow testing on atca shelves and blades using the cp-ta test tools; chassis scan and blade profiler.
overview: the introduction to this discussion will review the overall capabilities and techniques of the degree controls center for airflow and thermal testing (catt). this will lead to an overview of the basic airflow requirements in the cp-ta interoperability control document (icd 1.0). the workshop will also discuss how to complete the necessary tests within the test procedure manual (tpm 1.0) using the new measurement tools from cp-ta and degree controls. both blade profiler and chassis scan will be demonstrated through data collection on actual atca hardware.
jason lebouef, thermal engineer and laboratory manager
vacuum insulated tubes and assemblies, and integrated cooling packages for electronics
concept group will be demonstrated with video and live demonstrations the insulating performance of some of their vacuum insulated micro-tubing products currently being utilized in cryoablation surgery of the prostate (>10% of all prostate procedures use cryoablation surgery). conceptual liquid cooling integration into standard electronic packages will also be demonstrated.
paul stepanoff, concept group, inc.
high pressure liquid pumps for electronics thermal management
high heat load electronics applications require cooling solutions that can remove large amounts of heat in a small space. micropump, a idex company has developed a small, low flow, high pressure pump for high volume applications. this presentation will cover the pump technology and its application in water based and two phase cooling solutions.
mike minnick, micropump inc.
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